Zobrazeno 1 - 10
of 83
pro vyhledávání: '"Heiner Bauer"'
Autor:
Hector A. Gonzalez, Bernhard Vogginger, Chen Liu, Marco Stolba, Florian Kelber, Heiner Bauer, Stefan Hänzsche, Stefan Scholze, Marc Berthel, Tim Rosmeisl, Liyuan Guo, Dennis Walter, Piash Das, Khaleelulla Khan, Tilo Schubert, Sebastian Höppner, Christian Mayr
Publikováno v:
2023 IEEE Custom Integrated Circuits Conference (CICC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e5673ec56028d7d92c1024544c64c15
https://doi.org/10.1109/cicc57935.2023.10121258
https://doi.org/10.1109/cicc57935.2023.10121258
Autor:
Jörg Schreiter, Thorsten Riedel, Thomas Hocker, Heiner Bauer, Florian Schraut, Andre Scharfe, Matthias Nossmann, Alexander Oefelein, Helmut Prengel, Stephan Henker, Holger Eisenreich, Sebastian Hoppner, Ulrich Hensel, Stephan Scherzer, Stefan Scholze, Dennis Walter, Robert Niebsch
Publikováno v:
IEEE Transactions on Circuits and Systems II: Express Briefs. 67:2159-2163
A 0.5V ultra-low voltage Arm Cortex-M4F MCU in a 22nm FDSOI technology with 512kB SRAM and 140MHz operating frequency with $11.5~\mu {\mathrm{ W}}/{\mathrm{ MHz}}$ is presented. An all-digital closed-loop continuous adaptive body biasing with individ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bede185084cf68667bf19abc5a62950
https://doi.org/10.1109/tcsii.2019.2959544
https://doi.org/10.1109/tcsii.2019.2959544
Autor:
Seyed Mohammad Ali Zeinolabedin, Franz Marcus Schuffny, Richard George, Florian Kelber, Heiner Bauer, Stefan Scholze, Stefan Hanzsche, Marco Stolba, Andreas Dixius, Georg Ellguth, Dennis Walter, Sebastian Hoppner, Christian Mayr
Publikováno v:
IEEE Transactions on Biomedical Circuits and Systems
With the advent of high-density micro-electrodes arrays, developing neural probes satisfying the real-time and stringent power-efficiency requirements becomes more challenging. A smart neural probe is an essential device in future neuroscientific res
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::70db0c9b211ee540d418ffc3f0d944c8
Autor:
Hendrik Deckert, Sebastian Hoppner, Chris Paul Iatrou, Philipp Bauer, Leon Urbas, Christian Mayr, Gerhard Fettweis, Zohra Charania, Robert Wittig, Valentin Khaydarov, René Bachmann, Richard Jacob, Heiner Bauer
Publikováno v:
IECON
With the advent of the fourth industrial revolution i.e. Industry 4.0, plants and factories are becoming smarter and interconnected. The transitions demand vertical integration and seamless connectivity. For this purpose, there is a need for semantic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5291e251671ae2eab2c1be637b204e70
https://doi.org/10.1109/iecon48115.2021.9589043
https://doi.org/10.1109/iecon48115.2021.9589043
Autor:
Felix Neumarker, Dennis Walter, Stephan Hartmann, Christian Mayr, Leon Urbas, Georg Ellguth, Florian Kelber, Zohra Charania, M. Berthel, Chris Paul Iatrou, Andreas Dixius, Sebastian Hoppner, Johannes Uhlig, Heiner Bauer, Saif Ur Rehman, Marco Stolba
Industrial plants suffer from a high degree of complexity and incompatibility in their communication infrastructure, caused by a wild mix of proprietary technologies. This prevents transformation towards Industry 4.0 and the Industrial Internet of Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::392f3167f04512ac481ba74699eb57e4
http://arxiv.org/abs/2105.00789
http://arxiv.org/abs/2105.00789
Publikováno v:
New Ceramics; Nov/Dec2012, Issue 6, p6-6, 1/6p
Autor:
Florian Schraut, Holger Eisenreich, Heiner Bauer, Dennis Walter, Andre Scharfe, Robert Niebsch, Sebastian Höppner, Alexander Oefelein, Farkas Csaszar, Jörg Schreiter
Publikováno v:
COOL CHIPS
An ultra-low-voltage (ULV) Arm® Cortex®-M4 MCU in 22FDX technology is presented, operating at 0.55V. The circuit employs adaptive body bias (ABB) in a reverse bias scheme with independent control of NMOS and PMOS device performance and has been imp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4706cefdca6c756dcebef044cfe3ea9d
https://doi.org/10.1109/coolchips49199.2020.9097639
https://doi.org/10.1109/coolchips49199.2020.9097639
Publikováno v:
ETFA
The fast semantics project examines the use of the OPC Unified Architecture (OPC UA) in embedded industrial systems and proposes the design of a customizable, hard real time capable OPC UA Intellectual Property Core (IP Core) for single chip computin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63af648d4287823d1c3763b4d8ffa340
https://doi.org/10.1109/etfa.2019.8868968
https://doi.org/10.1109/etfa.2019.8868968
Autor:
Holger Eisenreich, Robert Niebsch, Jorg Winkler, Heiner Bauer, Robert Sinkwitz, Dennis Walter, Andre Scharfe Clifford Dmello, Mario Orgis, Uwe Steeb, Alexander Oefelein, Stephan Scherzer, Sebastian Hoppner, Florian Schraut, Jörg Schreiter, Ulrich Hensel
Publikováno v:
ESSDERC
Adaptive body biasing is a technique to reduce detrimental effects on performance and leakage implied by both process variability and operating conditions in FDSOI technologies. Forward body biasing, optimally applied over all process corners and ope
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c99f8c7ecb4c435d38aaafebc55a66fa
https://doi.org/10.1109/essderc.2019.8901768
https://doi.org/10.1109/essderc.2019.8901768
Autor:
Christian Mayr, Sebastian Hoppner, Heiner Bauer, Dennis Walter, Johannes Partzsch, Florian Schraut, Holger Eisenreich
Publikováno v:
NORCAS
Reconfigurable microprocessors extend the concept of application specific instruction set processors (ASIPs) to allow customization at runtime. Previous research mainly focused on exploiting this feature in high-level applications, without regard to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72bb426231e861e35d828deaf9a352e1
https://doi.org/10.1109/norchip.2017.8124946
https://doi.org/10.1109/norchip.2017.8124946