Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Heiko Thust"'
Publikováno v:
Microelectronics Reliability. 46:352-359
As-fired thick-film resistors have the resistance tolerance within ±20% and this tolerance is increased for smaller components. Therefore the novel trimming methods are necessary for microresistors, especially when they are embedded in LTCC substrat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6930245e92ebe36c2347c0963c02d5cb
https://doi.org/10.1016/j.microrel.2004.12.014
https://doi.org/10.1016/j.microrel.2004.12.014
Publikováno v:
International Journal of Applied Ceramic Technology. 2:383-389
For modern gas sensors, low power consumption is expected. It is well known that with low temperature cofiring technology (LTCC) small compact sensors can be constructed. Compared with standard devices on alumina such sensors consume less power due t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cfaf93d9bf684724e14dbffef51850bf
https://doi.org/10.1111/j.1744-7402.2005.02037.x
https://doi.org/10.1111/j.1744-7402.2005.02037.x
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 2:155-161
This paper presents some results of our investigations in the integration of coils in LTCC using the Fodel® Technology as line patterning technology. Planar as well as 3-D inductors were simulated, manufactured, measured and modeled. The structures
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1aee9826d7ae167f0db75c26c1eaf2a9
https://doi.org/10.4071/1551-4897-2.2.155
https://doi.org/10.4071/1551-4897-2.2.155
Publikováno v:
Microelectronics International. 19:19-23
A characteristic feature of LTCC is good workability. In some cases a LTCC‐based microsystem can be a good alternative to microsystems made in silicon or other technologies. Reasons for choosing LTCC‐Technology may be financial considerations or
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c4729d20328d74490bdbb0ca4987921
https://doi.org/10.1108/13565360210445005
https://doi.org/10.1108/13565360210445005
Autor:
Jaroslaw Kita, Andrzej Dziedzic, Reinhard Bauer, Klaus-Jurgen Wolter, Lars Rebenklau, Heiko Thust, Leszek Golonka, K.-H. Drue
Publikováno v:
Microelectronics Reliability. 41:669-676
This paper presents systematic investigations of electrical and stability properties of various low temperature co-fired ceramics (LTCC) resistors. One of the goals of this work was to check the compatibility of LTCC materials (tapes, resistive and c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fbb907f28b44b93092a49f6909807cb2
https://doi.org/10.1016/s0026-2714(01)00004-x
https://doi.org/10.1016/s0026-2714(01)00004-x
Publikováno v:
Microelectronics International. 16:46-53
The paper presents the application of two advanced thick‐film techniques: etching of fired thick‐films and photoimaging of photosensitive thick‐films for fabrication bandpass microwave filters operating in the frequency range from 6 to 14 GHz.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f8a0dbb413ca910b12f057b289a6361
https://doi.org/10.1108/13565369910293350
https://doi.org/10.1108/13565369910293350
Publikováno v:
Microelectronics International. 15:34-38
Thermal properties of Pt or RuO2 thick‐film heaters made on alumina, aluminum nitride or low temperature co‐fired ceramics (LTCC) were compared in the first step of our work. Special holes to improve the heat distribution were included. Several h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d924d84ffbc04ae1ae9564eaf4cf4576
https://doi.org/10.1108/13565369810215618
https://doi.org/10.1108/13565369810215618
Autor:
Jens Muller, Heiko Thust
Publikováno v:
Ceramic Interconnect Technology Handbook ISBN: 9781315221281
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::26266be5852cdaa66fa2ec465a8cd17e
https://doi.org/10.1201/9781420018967.ch9
https://doi.org/10.1201/9781420018967.ch9
Autor:
Heiko Thust, Ruben Perrone, J.F. Trabert, Matthias Hein, A. Molke, R. Kulke, Jens Muller, Jurgen Pohlner, G. Reppe, C. Kutscher, P. Uhlig, K.-H. Drue, Ralf Stephan, D. Schwanke, T. Baras, A.F. Jacob
Publikováno v:
2006 1st Electronic Systemintegration Technology Conference.
Low temperature co-fired ceramics (LTCC) is being widely used for microwave circuits. The BMBF funded R&D-project KERAMIS focuses on larger implementation of functionality in LTCC substrates to allow designs with "standard" MMICs. Target applications
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eeaafe0fdafcca7a153aa8b2f4eda8ed
https://doi.org/10.1109/estc.2006.279987
https://doi.org/10.1109/estc.2006.279987
Publikováno v:
Scopus-Elsevier
Hot-plate LTCC gas sensors combine advantages of silicon structures (low power consumption) and typical ceramics gas sensors (stability and reliability). Such elements can be integrated in MEMS packages as well as in ceramic sensor arrays. Moreover,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::de6e49102fcdb34db5593d774c1318f2
http://www.scopus.com/inward/record.url?eid=2-s2.0-27844578426&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-27844578426&partnerID=MN8TOARS