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pro vyhledávání: '"Heikkinen, Hannele"'
Akademický článek
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Autor:
Puurunen, Riikka L., Ali, Saima, Arstila, Kai, Berdova, Maria, Haimi, Eero, Heikkinen, Hannele, Julin, Jaakko, Kilpi, Lauri, Laitinen, Mikko, Liu, Xuwen, Lyytinen, Jussi, Malm, Jari, Pyymaki-Perros, Alexander, Rontu, Ville, Sintonen, Sakari, Ylivaara, Oili, Sajavaara, Timo, Lipsanen, Harri, Franssila, Sami, Koskinen, Jari, Ronkainen, Helena, Hannula, Simo-Pekka, Kiihamäki, Jyrki
Publikováno v:
Puurunen, R L, Ali, S, Arstila, K, Berdova, M, Haimi, E, Heikkinen, H, Julin, J, Kilpi, L, Laitinen, M, Liu, X, Lyytinen, J, Malm, J, Pyymaki-Perros, A, Rontu, V, Sintonen, S, Ylivaara, O, Sajavaara, T, Lipsanen, H, Franssila, S, Koskinen, J, Ronkainen, H, Hannula, S-P & Kiihamäki, J 2015, Mechanical property mapping of ALD thin films . in Technical Program & Abstracts . American Vacuum Society (AVS), 13th International Baltic Conference on Atomic Layer Deposition, Baltic ALD 2015, Tartu, Estonia, 28/09/15 .
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=355e65625b88::f68ea465f348978099e21d2bc47f739d
https://cris.vtt.fi/en/publications/d7143751-1332-4e73-8f0b-9a397d66d07e
https://cris.vtt.fi/en/publications/d7143751-1332-4e73-8f0b-9a397d66d07e
Publikováno v:
Heikkinen, H, Ylivaara, O, Grönberg, L & Puurunen, R L 2015, Thin film stress measurement and error determination : ALD Al2O3 films with different wafer sizes . in Technical Program & Abstracts . American Vacuum Society (AVS), 13th International Baltic Conference on Atomic Layer Deposition, Baltic ALD 2015, Tartu, Estonia, 28/09/15 .
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=355e65625b88::27c4ed3fdc4fbb188bf4807b9f86fa9f
https://cris.vtt.fi/en/publications/7eafe12d-203a-4b81-b176-9439c53ed216
https://cris.vtt.fi/en/publications/7eafe12d-203a-4b81-b176-9439c53ed216
Autor:
Suni, Tommi, Xu, H, Heikkinen, Hannele, Dekker, James, Vuorinen, V, Jaakkola, Antti, Monnoyer, Philippe, Paulasto-Kröckel, M
Publikováno v:
Suni, T, Xu, H, Heikkinen, H, Dekker, J, Vuorinen, V, Jaakkola, A, Monnoyer, P & Paulasto-Kröckel, M 2013, Wafer level MEMS encapsulation using SLID bonding . in Book of abstracts . Stockholm, pp. 105-106, International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration, Waferbond'13, Stockholm, Sweden, 5/12/13 .
We have studied copper-tin and gold-tin solid-liquid interdiffusion bonding for MEMS encapsulation. Different electroplating processes, seal ring thicknesses and bonding processes were tested. Bonding quality was studied with cross sectional scanning
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=355e65625b88::3d9f01e9521d4941d53a9197409d57b6
https://cris.vtt.fi/en/publications/a87f7c7b-8d86-4094-a069-435f41b8e7ba
https://cris.vtt.fi/en/publications/a87f7c7b-8d86-4094-a069-435f41b8e7ba
Autor:
Gädda, Akiko, Salonen, Jaakko, Vähänen, Sami, Monnoyer, Philippe, Heikkinen, Hannele, Pohjonen, Harri, Eränen, Simo
Publikováno v:
Gädda, A, Salonen, J, Vähänen, S, Monnoyer, P, Heikkinen, H, Pohjonen, H & Eränen, S 2012, Modeling of the underfill flow process in the flip chip bonded pixel detectors . in J Kutilainen (ed.), Proceedings : IMAPS Nordic Conference 2012 . IMAPS Nordic, pp. 82-85, IMAPS Nordic Annual Conference 2012, Helsingor, Denmark, 2/09/12 .
Modeling of the underfilling process of the flip chip bonded components has been studied. The size of the hybridized pixel detectors used in the flip chip bonding process varied up to 1 cm * 1.6 cm. An underfill was required to enhance the mechanical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=355e65625b88::b0003e54dedb32deee62a27f2924580b
https://cris.vtt.fi/en/publications/60baae16-83e4-4b54-b275-fc8250c271f5
https://cris.vtt.fi/en/publications/60baae16-83e4-4b54-b275-fc8250c271f5
Autor:
Gädda, Akiko, Salonen, Jaakko, Suni, Tommi, Vähänen, Sami, Monnoyer, Philippe, Heikkinen, Hannele, Pohjonen, Harri
Publikováno v:
Gädda, A, Salonen, J, Suni, T, Vähänen, S, Monnoyer, P, Heikkinen, H & Pohjonen, H 2011, Electroless Nickel and Immersion Gold deposition on Single Chips for Flip Chip Assembly of Pixel Detectors . in J Kutilainen (ed.), IMAPS Nordic Annual Conference 2011 . Curran Associates Inc., Finland, pp. 36-44, IMAPS Nordic Annual Conference 2011, Espoo, Finland, 5/06/11 .
Single chip handling has received significant attention for the diced chip without an Under Bump Metallization (UBM). In many cases, the Electroless Nickel Immersion Gold (ENIG) process is a suitable method to deposit UBM layer. Especially creating a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=355e65625b88::9672cd65e340dd9c606f62f806c1f0bb
https://cris.vtt.fi/en/publications/94cba9cb-2fe3-4330-9649-eac172420e70
https://cris.vtt.fi/en/publications/94cba9cb-2fe3-4330-9649-eac172420e70
Publikováno v:
Vähä-Heikkilä, T, Marttila, I & Heikkinen, H 2010, High quality factor integrated passive devices for microwave and millimeter wave applications . in Proceedings of 5th ESA Workshop on Millimetre Wave Technology and Applications . European Space Agency (ESA), Noordwijk, pp. 247-251, 5th ESA Workshop on Millimetre Wave Technology and Applications and 31st ESA Antenna Workshop, Noordwijk, Netherlands, 18/05/09 .
A fabrication process and multi project wafer run (MPW) service has been developed for realizing integrated passive devices. The fabrication process is simple and low cost ranging applications from consumer electronics to instrumentation and measurem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=355e65625b88::e6859593efc875c300567ac06cf79a06
https://cris.vtt.fi/en/publications/44a04822-04aa-4e26-a8a8-c08a51c5d29f
https://cris.vtt.fi/en/publications/44a04822-04aa-4e26-a8a8-c08a51c5d29f
Publikováno v:
Kattelus, H, Heikkinen, H, Häärä, A, Ylönen, M & Tolkki 2003, ' A batch process to deposit amorphous metallic Mo-Si-N films ', Journal of Materials Science: Materials in Electronics, vol. 14, no. 5-7, pp. 427-430 . https://doi.org/10.1023/A:1023925423733
A process for depositing amorphous electrically conducting Mo–Si–N films in a batch-type reactive sputtering system has been developed. Each elemental constituent in the film is individually adjustable: molybdenum and silicon through the electric
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=355e65625b88::b40400bdee9dc020759caff2ace1a03a
https://cris.vtt.fi/en/publications/ea357bb9-af78-4ae9-b509-666c6d8b30df
https://cris.vtt.fi/en/publications/ea357bb9-af78-4ae9-b509-666c6d8b30df
Publikováno v:
Kattelus, H, Heikkinen, H, Häärä, A, Ylönen, M & Tolkki, A 2002, A batch process for depositing amorphous metallic Mo-Si-N films . in Conference Papers 2002. 4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002 : Espoo, FI, 10-12 June 2002 . IOM Communications Ltd., London, UK, pp. 125-128, 4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002, Espoo, Finland, 10/06/02 .
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=355e65625b88::51b122c5af1b3baa9fb16db3e80010a5
https://cris.vtt.fi/en/publications/c34008c1-d564-4734-babf-b9b8d38e6906
https://cris.vtt.fi/en/publications/c34008c1-d564-4734-babf-b9b8d38e6906
Autor:
Zoschke, K., Manier, C.-A., Wilke, M., Jurgensen, N., Oppermann, H., Ruffieux, D., Dekker, J., Heikkinen, Hannele, Piazza, S. Dalla, Allegato, G., Lang, K.-D.
Publikováno v:
2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1500-1507, 8p