Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Hefin Griffiths"'
Publikováno v:
Energies, Vol 13, Iss 4, p 833 (2020)
This Special Issue of the Energies Journal on Deep Borehole Disposal of Nuclear Waste has delivered a timely update on the science and technology of borehole disposal and the types of radioactive wastes it could potentially accommodate. The Special I
Externí odkaz:
https://doaj.org/article/632cfd37e9854618aa71c8f223ac16be
Publikováno v:
Energies, Vol 13, Iss 4, p 833 (2020)
This Special Issue of the Energies Journal on Deep Borehole Disposal of Nuclear Waste has delivered a timely update on the science and technology of borehole disposal and the types of radioactive wastes it could potentially accommodate. The Special I
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9c8c68b8485e8fc272179dcf27455fd3
https://doi.org/10.3390/en13040833
https://doi.org/10.3390/en13040833
Autor:
Moshe Kriman, Hagit Gershtenman-Avsian, Dorleta Cortaberria Sanz, Oliver Ansell, Hefin Griffiths, Matthew Muggeridge, Andrey Grinman, Dave Thomas, Mike Steel
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:002254-002271
Miniature, high performance camera modules are found in a range of consumer devices including phones, PDAs, cameras and gaming consoles. According to Gartner the $1B image sensor market will grow to $2.3B by 2013. Image sensor packaging technologies
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6adb28e594e0a6233d253e39618e9f3
https://doi.org/10.4071/2011dpc-tha22
https://doi.org/10.4071/2011dpc-tha22
Autor:
Mark Carruthers, Oliver Ansell, Hefin Griffiths, Keith Buchanan, Kath Crook, Dave Thomas, Dan Archard
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
This paper will focus on 300mm etch and CVD technologies for via reveal (VR) processing. Data on silicon etching will show that etch rates >5μm/min, with uniformity ±2.5% and selectivity to the liner oxide around ∼200:1 can be achieved on bonded
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84e6f04e08649113a84615ef6d6b9782
https://doi.org/10.1109/ectc.2012.6249061
https://doi.org/10.1109/ectc.2012.6249061
Autor:
Daniel Archard, Masahiko Tanaka, Mark Carruthers, Hefin Griffiths, Dave Thomas, Kathrine Crook, Keith Buchanan
Publikováno v:
3DIC
Through-Silicon Vias [TSV] offer improved system performance by reducing interconnect length to increase device speeds, and by using stacking to reduce package form-factors and enabling heterogeneous device integration. Via Reveal' [VR] — a sequenc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a595cb60808e71e25abf85756b4733de
https://doi.org/10.1109/3dic.2012.6262986
https://doi.org/10.1109/3dic.2012.6262986
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
With the adoption of TSVs (through-silicon vias) becoming more widespread, as the technologies and process flows necessary for the creation of the vias are established, back-end processes are receiving additional focus.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2e4387dd6c6cc82750cd48149db6f3a
https://doi.org/10.1109/eptc.2011.6184488
https://doi.org/10.1109/eptc.2011.6184488
Autor:
Philippe M. Vereecken, Christophe Detavernier, Nele Moelans, Hefin Griffiths, Marc Schaekers, Matty Caymax, Francesca Iacopi, Bart Blanpain, Jan D'Haen
Publikováno v:
Scopus-Elsevier
ResearcherID
ResearcherID
The use of Au nanoparticles as catalysts for growth of Si nanowires poses fundamental reliability concerns for applications in Si semiconductor technology. In this work we show that the choice of catalysts can be broadened when the need for catalytic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4a508fcbf2b80197ceed53185739ca98
http://www.scopus.com/inward/record.url?eid=2-s2.0-70349910284&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-70349910284&partnerID=MN8TOARS
