Výsledky vyhledávání - "Heeren, M.M.G."

Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry

Autor: Brand, J. van den, Kusters, R.H.L., Heeren, M.M.G., Remoortere, B. van, Dietzel, A.H.

Publikováno v: 3rd Electronics System Integration Technology Conference, ESTC 2010, 13-16 September 2010, Berlin, Germany

All-printed, cost effective, smart electronic products are expected to be used in a wide range of applications and in large quantities in our society. The substrate material for these applications will be low cost materials like PEN or PET foils. For

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