Zobrazeno 1 - 5
of 5
pro vyhledávání: '"HeeYeoul Yoo"'
Autor:
GaWon Kim, Choonheung Lee, SeungJae Lee, Jiheon Yu, Jin Young Kim, GyuIck Jung, HeeYeoul Yoo, Nozard Karim
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
In this paper, coreless flip-chip BGA in Amkor Technology will be introduced with two options. First option is a revised coreless substrate design with layer reduction from original core substrate design of flip-chip BGA package and the second one is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53799a4c4ddb85b5855b7636bc0b7a85
https://doi.org/10.1109/ectc.2011.5898573
https://doi.org/10.1109/ectc.2011.5898573
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
As one of the alternative materials in chip interconnection, copper wire has become popular because of its lower cost and higher electrical conductivity than gold wire. Moreover it is known that long term reliability performance at high temperature o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c4318a10c8b7083de825dff353af3df
https://doi.org/10.1109/ectc.2011.5898747
https://doi.org/10.1109/ectc.2011.5898747
Autor:
GaWon Kim, Choonheung Lee, Jiheon Yu, Kicheol Bae, Jin Young Kim, SangWon Kim, HeeYeoul Yoo, SeungJae Lee
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
In this paper, developments of wafer level fan-out (WLFO) technology using organic substrates, ajinomoto build-up film (ABF) with laser ablation process and buried pattern PCB, are introduced for low cost and high electrical performance not only on l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa0bfbdcee9e3b007d53ba7bcc937e90
https://doi.org/10.1109/estc.2010.5642956
https://doi.org/10.1109/estc.2010.5642956
Publikováno v:
2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1740-1745, 6p
Autor:
SeungJae Lee, SangWon Kim, GaWon Kim, KiCheol Bae, JiHeon Yu, JinYoung Kim, HeeYeoul Yoo, ChoonHeung Lee
Publikováno v:
Electronic System-Integration Technology Conference (ESTC), 2010 3rd; 2010, p1-6, 6p