Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Hedvi Spielberg"'
Autor:
Hyunsok Kim, Ikhyun Jeong, Baikkyu Hong, Sejung Ham, Dongsu Kim, Dongsuk Lim, Kangmin Lee, Jeongpyo Lee, Minho Jung, Nanglyeom Oh, Dongsub Choi, Hedvi Spielberg, Ohad Bachar
Publikováno v:
Metrology, Inspection, and Process Control XXXVII.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::353269b1161aab4f664663159521c4ad
https://doi.org/10.1117/12.2670420
https://doi.org/10.1117/12.2670420
Autor:
Shlomit Katz, Suk Won Park, Joonsang You, Hyunjun Kim, Hong Goo Lee, Jungchan Kim, Dongyoung Lee, Hongbok Yeon, Joon-Seuk Lee, Sang-Ho Lee, Jae Wook Seo, Dor Yehuda, Junho Kim, Hongcheon Yang, DoHwa Lee, Nanglyeom Oh, DongSub Choi, Wayne Zhou, Hedvi Spielberg, Ohad Bachar
Publikováno v:
Metrology, Inspection, and Process Control XXXVII.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4ae546ca830c02f1716b12852fdfc72
https://doi.org/10.1117/12.2655681
https://doi.org/10.1117/12.2655681
Autor:
Hyun-Sok Kim, Ikhyun Jeong, Baikkyu Hong, Sunouk Nam, Sumin Jang, Kangmin Lee, Hongpeng Su, Minho Jeong, Mingyu Kim, Hongcheon Yang, Wayne Zhou, Nanglyeom Oh, DongSub Choi, Tal Yaziv, Hedvi Spielberg, Ohad Bachar, Rawi Dirawi
Publikováno v:
Metrology, Inspection, and Process Control XXXVII.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78f51fe1a7382a07e568f494f3690c2e
https://doi.org/10.1117/12.2657678
https://doi.org/10.1117/12.2657678
Autor:
Hyunsok Kim, Jaewuk Ju, Ikhyun Jeong, Baikkyu Hong, Sunouk Nam, Changkyu Lee, Kangmin Lee, Sumin Jang, Jaeyoun Lee, Hongcheon Yang, Minho Jeong, Mingyu Kim, Hongpeng Su, Wayne Zhou, Nanglyeom Oh, DongSub Choi, Tal Yaziv, Hedvi Spielberg, Ohad Bachar, Renan Milo, Rawi Dirawi
Publikováno v:
Metrology, Inspection, and Process Control XXXVII.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c05aa936e1e9836d39d6691bea3e420
https://doi.org/10.1117/12.2657632
https://doi.org/10.1117/12.2657632
Autor:
Nahee Park, Dohwa Lee, Liu Liu, Xuefei Zhou, Hongpeng Su, DongSub Choi, Wayne Zhou, Hedvi Spielberg, Efi Megged, Chen Dror, Diana Shaphirov, Zephyr Liu, Mark Ghinovker, DongYoung Lee, Hongbok Yeon, Hyunjun Kim, Sukwon Park, Bohye Kim, Honggoo Lee, Sangho Lee
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87c2c7efc3be8f8bbcc7e2039896893f
https://doi.org/10.1117/12.2608053
https://doi.org/10.1117/12.2608053
Autor:
Vladimir Levinski, Yuri Paskover, Sharon Aharon, Daria Negri, Nadav Gutman, Nireekshan Reddy Kothakapu, Jeongpyo Lee, Hedvi Spielberg, DongYoung Lee, Hyunjun Kim, Sukwon Park, Bohye Kim, Hongseok Jang, Honggoo Lee, Sangho Lee
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e3f04d821d4b9f0b6190cd4e899c118
https://doi.org/10.1117/12.2613981
https://doi.org/10.1117/12.2613981
Autor:
Moran Zaberchik, Scott Beatty, Sanghuck Jeon, Nir BenDavid, Chanha Park, Sang Ho Lee, Dongsub Choi, Dongyoung Lee, Telly Koffas, Chen Li, Ramkumar Karur-Shanmugam, Dongsoo Kim, Honggoo Lee, Jae Young Park, Hedvi Spielberg, Efi Megged, Dohwa Lee
Publikováno v:
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV.
We developed a statistical method that can be applied to overlay metrology tools to improve performance and time-to-results (TTR) of multi-cycle optimization based on the brute force method. First, we evaluated full response surfaces for each combina
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40281cffdd759f39620381e8b04e1092
https://doi.org/10.1117/12.2583638
https://doi.org/10.1117/12.2583638
Autor:
Katya Gordon, Hedvi Spielberg, Diana Shaphirov, Xiaolei Liu, Eltsafon Ashwal, Eitan Hajaj, Philippe Leray, Mark Ghinovker, Chen Dror, Raviv Yohanan, Zephyr Liu, Dieter Van den Heuvel, Roel Gronheid
Publikováno v:
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV.
As design nodes of advanced semiconductor chips shrink, reduction in on-product overlay (OPO) budget becomes more critical to achieving higher yield. Imaging-based overlay (IBO) targets usually consist of periodic patterns where their pitches are res
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a71df7b888ddfb6580f81ecc9e7b9d1
https://doi.org/10.1117/12.2585876
https://doi.org/10.1117/12.2585876
Autor:
Hedvi Spielberg, Raviv Yohanan, Alon Volfman, Eitan Hajaj, Xindong Gao, Xiaolei Liu, Yoav Grauer
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIV.
For today’s advanced processes, in order to achieve higher optical lithography resolution, some of the layers require extreme dipole illumination conditions. One example is the modern DRAM process, where numerous critical layers are patterned with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff804f19cd01d2d6a2646a8c31e3c5ad
https://doi.org/10.1117/12.2551990
https://doi.org/10.1117/12.2551990
Autor:
Dae Jong Kim, Chul-Hong Kim, Hak Kwon Lee, Hyung Won Yoo, Yariv Bustan, Yun Ho Lee, Moshe Rozentsvige, Koon Ho Bae, Shimon Levi, Sung Su Kim, Hedvi Spielberg
Publikováno v:
SPIE Proceedings.
As design rules shrink, Critical Dimension Uniformity (CDU) and Line Edge Roughness (LER) have a dramatic effect on printed final lines and hence the need to control these parameters increases. Sources of CDU and LER variations include scanner auto-f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4bc14e837f82403dc88aac857ca4a417
https://doi.org/10.1117/12.848699
https://doi.org/10.1117/12.848699