Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Hector Esteban Gonzalez"'
Autor:
Jose A. Ballesteros, Angel Belenguer, Marcos D. Fernandez, Hector Esteban Gonzalez, Vicente E. Boria
Publikováno v:
IEEE Access, Vol 10, Pp 51412-51418 (2022)
Empty Substrate Integrated Waveguide (ESIW) technology preserves the many advantages of the Substrate Integrated Waveguide (SIW) such as low cost, low profile, and easy integration with Printed Circuit Boards (PCBs). Moreover, it has additional advan
Externí odkaz:
https://doaj.org/article/4a528ee79f144b20b9bae1e8f7fa19d9
Autor:
Vicente Nova, Carmen Bachiller Martin, Juan Angel Martinez, Hector Esteban Gonzalez, Jose Manuel Merello, Angel Belenguer Martinez, Oscar Monerris, Vicente E. Boria
Publikováno v:
IEEE Access, Vol 8, Pp 118072-118082 (2020)
Substrate Integrated (SI) technologies, either completely or partially filled with dielectric, as well as completely empty (i.e. without any dielectric material), have been object of intense research in the last years. Their performance in terms of l
Externí odkaz:
https://doaj.org/article/16e028cfacae4c97bf274a8dd495072a
Autor:
Juan A. Martinez, Angel Belenguer, Juan J. De Dios, Hector Esteban Gonzalez, Vicente E. Boria
Publikováno v:
IEEE Access, Vol 7, Pp 149406-149413 (2019)
Recently, Empty Substrate Integrated Waveguide (ESIW) technology was proposed for embedding empty waveguides into planar substrates in order to improve their performance. A low-loss and narrow-band transition from microstrip to an increased height ES
Externí odkaz:
https://doaj.org/article/5d84ab53e32d498b93417f563e2e0d62
Publikováno v:
IEEE Microwave and Wireless Technology Letters. 33:255-258
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::017a084545e52f12caaf365ed8516106
https://doi.org/10.1109/lmwc.2022.3216396
https://doi.org/10.1109/lmwc.2022.3216396
Autor:
Vicente Boria, Darío Herraiz Tirado, David Herraiz, Angel Belenguer, José Morro, Hector Esteban Gonzalez
Publikováno v:
IEEE Microwave and Wireless Technology Letters. 33:31-34
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e33373d2d2bd730ef929d9d8d358aed
https://doi.org/10.1109/lmwc.2022.3194564
https://doi.org/10.1109/lmwc.2022.3194564
Autor:
Vicente Boria, Darío Herraiz Tirado, David Herraiz, Angel Belenguer, Ana Vidal-Pantaleoni, Hector Esteban Gonzalez
Publikováno v:
IEEE Access, Vol 9, Pp 165745-165753 (2021)
RiuNet. Repositorio Institucional de la Universitat Politécnica de Valéncia
instname
RiuNet. Repositorio Institucional de la Universitat Politécnica de Valéncia
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[EN] The Empty Substrate IntegratedWaveguides (ESIW) maintain the advantages of the Substrate Integrated waveguide (SIW) (i.e. low-volume, low profile, lightweight, easy manufacturing, and integration in a planar circuit board), and present lower los
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::926ff8386fa56798df586e9714e8b3ec
https://ieeexplore.ieee.org/document/9642975/
https://ieeexplore.ieee.org/document/9642975/
Autor:
Marcos D. Fernandez, Vicente E. Boria, Hector Esteban Gonzalez, Jose A. Ballesteros, Angel Belenguer
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 68:2243-2250
Empty substrate integrated waveguide (ESIW) technology preserves the many advantages of the SIW, such as low cost, low profile, or integration in a printed circuit board. But, since the fields propagate through the air in the ESIW instead of propagat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8561f37f06b2402e399f7898e43cbf29
https://doi.org/10.1109/tmtt.2020.2984474
https://doi.org/10.1109/tmtt.2020.2984474
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 68:1520-1528
This article presents a systematic procedure aimed to design continuous profile stopband filters assembled with empty substrate integrated coaxial lines. The coaxial filter is made of five low-cost substrate layers, where the central boards contain t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::976d2b96c06ca4d7ac0423be35bfee5d
https://doi.org/10.1109/tmtt.2019.2963661
https://doi.org/10.1109/tmtt.2019.2963661
Autor:
Angel Belenguer Martínez, Jose Manuel Merello, Carmen Bachiller Martin, Vicente Nova, Juan Angel Martinez, Vicente E. Boria, O. Monerris, Hector Esteban Gonzalez
Publikováno v:
IEEE Access, Vol 8, Pp 118072-118082 (2020)
Substrate Integrated (SI) technologies, either completely or partially filled with dielectric, as well as completely empty (i.e. without any dielectric material), have been object of intense research in the last years. Their performance in terms of l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ddeef5f0ac7f589f59b0816992716a22
https://doi.org/10.1109/access.2020.3004875
https://doi.org/10.1109/access.2020.3004875
Autor:
Damini Gera, Hector Esteban Gonzalez, Sandra Hofmann, Ralf Wellens, Lourdes R. García, Christoph Sous, Aygun Baltaci, Christoph Bach, Dominic Schupke, Adrian Exposito Garcia
Publikováno v:
ICC Workshops
RiuNet. Repositorio Institucional de la Universitat Politécnica de Valéncia
instname
RiuNet. Repositorio Institucional de la Universitat Politécnica de Valéncia
instname
Using 5G networks for flying vehicles is an opportunity to provide reliable connectivity while reducing cost and requirements on size, weight and power consumption. Network slicing is one feature which is particularly of interest. It enables a reliab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::172389c414ec888454b0559fc24e2134
https://doi.org/10.1109/iccw.2019.8756738
https://doi.org/10.1109/iccw.2019.8756738
