Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Heather L. Ursino"'
Publikováno v:
Tissue Engineering Using Ceramics and Polymers ISBN: 9780128205082
Tissue Engineering Using Ceramics and Polymers
Tissue Engineering Using Ceramics and Polymers
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0248564be2dce72c49efb6d3d3bd1ed7
https://doi.org/10.1016/b978-0-12-820508-2.00018-0
https://doi.org/10.1016/b978-0-12-820508-2.00018-0
Autor:
Gustavo A. Abraham, Tilman Ahlfeld, Mauro Alini, Josephine B. Allen, Luigi Ambrosio, Marcela Arango-Ospina, Angela R. Armiento, Carlos Baleizão, Matthias W. Beckmann, Justus P. Beier, Serena M. Best, Nathalie Bleisinger, Aldo R. Boccaccini, Aijia Cai, Pablo C. Caracciolo, Ugo D’Amora, Ralf Dittrich, Matthias Epple, José Paulo S. Farinha, Alexandra Fehnel, Michael Gelinsky, Artur Hahn, Jie Huang, Bryan D. James, Rahasudha Kannan, Paul J. Kingham, Vijay Kumar Kuna, Felix T. Kurz, Sonja Kuth, Sangwon Lee, Jessica Z. Liu, Liliana Liverani, Helen H. Lu, Christopher M. Ludtka, Peter X. Ma, João F. Mano, Jonathan Mansbridge, Debora Morgante, Viviana Mouriño, Showan N. Nazhat, J. Miguel Oliveira, Hyeree Park, Laurens Parmentier, Sandra Pina, Matthäus D. Popov Pereira da Cunha, Maria G. Raucci, Rui L. Reis, Guadalupe Rivero, Alfredo Ronca, Derek H. Rosenzweig, Tim Ruhl, Florian Ruther, Benedikt Schäfer, Viktoriya Sokolova, Jennifer Southgate, Márcia T. Tavares, Heather L. Ursino, Andrea J. Vernengo, Sandra Van Vlierberghe, Lena Vogt, Guobao Wei
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d71d19ed2443890d3f77fce1e8cc7e9
https://doi.org/10.1016/b978-0-12-820508-2.09992-x
https://doi.org/10.1016/b978-0-12-820508-2.09992-x
Autor:
Anthony P. Leggiero, Heather L. Ursino, Kylie J. Trettner, Eitan Zeira, Dylan J. McIntyre, Mark W. Schauer, Cory D. Cress, Brian J. Landi
Publikováno v:
ACS Applied Nano Materials. 2:118-126
Site-selective copper nanometal seeding through chemical vapor deposition (CVD) is demonstrated as a viable method in concert with solution electrodeposition of bulk Cu to enhance the electrical conductivity of a porous, low-density (0.12 g/cm3, ∼9