Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Heath Pois"'
Autor:
Byung Cheol (Charles) Kang, Michael Lenahan, Mainul Hossain, Naren Yellai, Paul Isbester, Tom Larson, Prasad Dasari, Givantha Iddawela, Mark Klare, Alok Vaid, Wei Ti Lee, Michael Kwan, Matthew Sendelbach, Padraig Timoney, Sridhar Mahendrakar, Heath Pois, Cornel Bozdog, Abner Bello
Publikováno v:
SPIE Proceedings.
Complexity of process steps integration and material systems for next-generation technology nodes is reaching unprecedented levels, the appetite for higher sampling rates is on the rise, while the process window continues to shrink. Current thickness
Autor:
Timothy J. McArdle, Michael Kwan, Alok Vaid, Mark Klare, Heath Pois, Ganesh Subramanian, Wei Ti Lee, Jeremy A. Wahl, Ying Wang, Dina H. Triyoso, Mainul Hossain, Abner Bello, Tom Larson
Publikováno v:
SPIE Proceedings.
Planar fully-depleted silicon-on-insulator (FDSOI) technology potentially offers comparable transistor performance as FinFETs. pFET FDOSI devices are based on a silicon germanium (cSiGe) layer on top of a buried oxide (BOX). Ndoped interfacial layer
Autor:
Jennifer Fullam, Wei Ti Lee, Bing Sun, Srinivasan Rangarajan, Saiqa Farhat, Ying Wang, Mike Kwan, Mark Klare, Heath Pois, Nicolas Loubet, Qing Liu, Sylvian Maitrejean, Tom Larson, B. Lherron, Romain Wacquez, John G. Gaudiello
Publikováno v:
25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014).
The thickness and composition determination of Silicon-Germanium (SiGe) films have been demonstrated using simultaneous X-ray Photoelectron (XPS) and X-ray Fluorescence (XRF) measurements. Measurements of SiGe films in various applications were explo
Autor:
Lena Nicolaides, Jon Opsal, InKyo Kim, Heath Pois, Jang-Ik Park, Jung-Wook Kim, Chung-sam Jun
Publikováno v:
SPIE Proceedings.
A new application for ultra-fast and repeatable in-die determination of CD structures at the ∼1 μm length scale using the BPR®/BPE® (Beam Profile Reflectometry/Ellipsometry) technologies on the Opti-Probe® OP9000 series system, is presented and
Publikováno v:
SPIE Proceedings.
In this study, the optical properties of amorphous carbon (aC) ARC films are investigated using an Opti-probe OP7341, and a metrology solution that robustly measures a broad range of process conditions is presented. We find that the aC material is co
Publikováno v:
SPIE Proceedings.
A selection of thin Si layers grown epitaxially upon thick relaxed SiGe films were measured using the combination of optical metrology techniques available on the Opti-Probe 7341 system. The techniques used included in particular (i) angle resolved l
Publikováno v:
SPIE Proceedings.
Spectra of contact hole arrays with target diameters ranging from 106 to 131 nm and pattern pitch ranging from 220 to 300 nm are taken from an off-axis (65°) rotating compensator spectroscopic ellipsometry (RCSE).[1] 3-dimensional finite difference
Publikováno v:
MRS Proceedings. 872
We demonstrate that a multi-technology approach enables the accurate characterization of the thickness and optical properties of Amorphous Carbon (α-C) films used in semiconductor manufacturing. Because the material is found to be highly birefringen
Publikováno v:
AIP Conference Proceedings.
We demonstrate that by using a multi‐technology optical metrology platform, accurate and precise measurements may be obtained for both thickness and stoichiometry of advanced Gate materials, including in particular Nitrided Oxide and Hafnium Silica
Autor:
Curry Scheirer, Boon Lay Tan, Kevin Peterlinz, Jacky Huang, Robert Jones, Shahin Zangooie, Stephen Morris, Dong Kyun Sohn, Heath Pois, JinPing Liu
Publikováno v:
AIP Conference Proceedings.
Graded Si1−xGex structures have been measured with good accuracy, stability and tool‐tool matching by utilizing different measurement methods in one system (Opti‐Probe®). The measurement methods utilized are (i) laser reflectivity versus angle