Zobrazeno 1 - 5
of 5
pro vyhledávání: '"He Sheng-zong"'
Publikováno v:
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Thin film resistor as a passive component, is widely used in automotive electronics, because of its smaller size, lower cost, high precision and low temperature coefficient. With the continuous development of new energy vehicle, the reliability of au
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15b4ef1772cad9837a1877dae6053fca
https://doi.org/10.1109/icept47577.2019.245146
https://doi.org/10.1109/icept47577.2019.245146
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
With the increase of integration and process complexity on semiconductor device, electrostatic discharge damage and defect damage have become an important cause of semiconductor device failure. However, electrostatic discharge damage and defect damag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::048106681d131ea68f413c0ad4414011
https://doi.org/10.1109/icept.2018.8480420
https://doi.org/10.1109/icept.2018.8480420
Autor:
He Sheng-Zong, Peng Ze-Ya, Chen Jin-Tao, Zhu Bin-Rue, Zhang Yin, Jiang Jian-Feng, Wang You-liang
Publikováno v:
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Power devices are widely used. Due to over burning and incidental destruction, direct failure analysis can't easily identify the real cause of failure. It is an essential technology for the analysis department of power device users to find out the ev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38524e5ae42df4531addab62112b2c3f
https://doi.org/10.1109/ipfa.2018.8452574
https://doi.org/10.1109/ipfa.2018.8452574
Publikováno v:
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
Merging units used in intelligent substation presented a considerable high field failure rate. To reveal the potential defects, highly accelerated life test was studied to solve the problem. The possible reasons for the poor reliability were discusse
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ddb4046c12f2ce8b78e82651d5f27e0a
https://doi.org/10.1109/icept.2017.8046607
https://doi.org/10.1109/icept.2017.8046607
Publikováno v:
2015 16th International Conference on Electronic Packaging Technology (ICEPT); 2015, p60-63, 4p