Zobrazeno 1 - 10
of 31
pro vyhledávání: '"He, Song Bai"'
Publikováno v:
Advances in Science, Technology and Engineering Systems Journal. 2:553-561
Publikováno v:
Advances in Science, Technology and Engineering Systems Journal. 2:291-301
Autor:
Sarra Alqahtani, Rose Gamble
Publikováno v:
Advances in Science, Technology and Engineering Systems Journal. 2:449-459
Autor:
Fatma Abdelhedi, Nabil Derbel
Publikováno v:
Advances in Science, Technology and Engineering Systems Journal. 2:513-519
Publikováno v:
The Journal of Engineering (2017)
Through silicon via (TSV) interconnect reliability is a problem in electronic packaging. The authors address the insertion losses, deflections which can result to separation of TSV layers and hoop stresses. These problems are due to different coeffic
Externí odkaz:
https://doaj.org/article/24599911df0f4d2ca5aa8949fd2088b6
Publikováno v:
Advances in Science, Technology and Engineering Systems, Vol 2, Iss 3, Pp 268-276 (2017)
Segmented and unsegmented 3D insulated copper through silicon vias (TSVs) of diameter 10 micro-meter, height 100 micro-meter and silicon of sizes 100 micro-meter by 100 micro-meter by 100 micro-meter are modeled using analysis system (ANSYS), equival
Publikováno v:
2016 International Conference on Integrated Circuits and Microsystems (ICICM).
A segmented and unsegmented 3D insulated copper through silicon vias (TSVs) of diameter 10μm, height 100μm and silicon of sizes 100μm by 100μm by 100μm are modelled using analysis system (ANSYS) and equivalent circuit using advanced design syste
Publikováno v:
2015 IEEE Advanced Information Technology, Electronic and Automation Control Conference (IAEAC).
Through Silicon Via Interconnects are usually protected with liners. A research on liners was done and conclusion made that they experience reliability problems like hoop stress which put them and the Through Silicon Via in danger. Simulation using A
Publikováno v:
Proceedings of the 2015 Joint International Mechanical, Electronic and Information Technology Conference.
Publikováno v:
2010 2nd International Conference on Advanced Computer Control.
The vehicle transportation support needs to make a set of transportation project and make decisions in a short time according to the task and environment, in which the time is limited, the workload is heavy, and is involved quite a few units under co