Zobrazeno 1 - 7
of 7
pro vyhledávání: '"He, Shengzong"'
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
ESD damage location and diagnosis is a difficult technology for complex IC chips. This study introduces several techniques of ESD damage location, diagnosis and analysis for complex chips, including conventional analysis techniques such as optical mi
Publikováno v:
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
The chip solder layer of power semiconductor devices carries the mechanical, thermal and electrical loads in the working state of devices. With the increase of packaging density and power density, the reliability requirement of solder layer is increa
Autor:
Yu Hongxin, Tie-zhu Chen, Zhang Youqiang, Yang Zhi-fan, Hu Lin, Liu Zujian, He Shengzong, Yuan Sheng-jun, Jiayong Zhong
Publikováno v:
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
This paper collected and classified the failure modes and mechanisms of quartz crystals from actual engineering application. Through related failure analysis cases, combined with scanning electron microscopy and energy spectrum analysis, failure anal
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology; 2014, p1169-1172, 4p
Publikováno v:
2014 10th International Conference on Reliability, Maintainability & Safety (ICRMS); 2014, p790-793, 4p
Autor:
Zhou, Guohua1 (AUTHOR) ghzhou-swjtu@163.com, He, Shengzong1 (AUTHOR), Zhang, Xi1 (AUTHOR), Zhong, Shu1 (AUTHOR)
Publikováno v:
Electronics Letters (Wiley-Blackwell). Jun2014, Vol. 50 Issue 13, p884-886. 3p.