Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Haw Y. Tai"'
Publikováno v:
IEEE Microwave and Wireless Components Letters. 30:1061-1064
Heterogeneous integration of IC chiplets into systems on a chip (SoC) is further revolutionizing the semiconductor industry. This letter introduces a metal embedded chiplet assembly for microwave integrated circuit (MECAMIC) technology that uses high
Autor:
Joel C. Wong, Haw Y. Tai, Helen Fung, D. Regan, D. F. Brown, Dayward Santos, Eric M. Prophet, Shawn D. Burnham, Miroslav Micovic, A. Kurdoghlian, Jesus Magadia, Isaac Khalaf, Yan Tang, Bob Grabar
Publikováno v:
IEEE Electron Device Letters. 38:1708-1711
We report the state-of-the-art $V$ -band power performance of a scaled 40-nm gate length Al0.23Ga0.77N/AlN/GaN/Al0.08Ga0.92N double heterojunction field effect transistor (DHFET). The $200~\mu \text{m}$ ( $4\times 50 ~\mu \text{m}$ ) wide GaN DHFETs
Autor:
Peter Chan, Haw Y. Tai, Helen Fung, D. F. Brown, Robert Grabar, Jeong-Sun Moon, Jongchan Kang
Publikováno v:
2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT).
GaN RF technology has continued to demonstrate state-of-the-art power, efficiency, linearity, and low-noise performance in RF and mm-wave band. Here, we report on a multi-octave (100 MHz–8 GHz), linear nonuniform distributed amplifier (NDPA) in a M
Autor:
Peter Chan, Dustin Le, D. F. Brown, D. Wong, Haw Y. Tai, C. McGuire, Helen Fung, Jeong-Sun Moon, Robert Grabar, Jongchan Kang
Publikováno v:
2017 IEEE Topical Conference on RF/Microwave Power Amplifiers for Radio and Wireless Applications (PAWR).
We report on a multi-octave (100 MHz–8 GHz), linear nonuniform distributed amplifier (NDPA) in a MMIC architecture using scaled 120-nm short-gate-length GaN HEMTs. The linear NDPAs were built with six sections in a nonuniform distributed amplifier
Autor:
Andy Fung, Adele E. Schmitz, Alexandros Margomenos, R. Bowen, Keisuke Shinohara, Haw Y. Tai, Robert Grabar, Helen Fung, Miroslav Micovic, Peter Chen, D. Regan, Andrea Corrion, H.P. Moyer, Shawn D. Burnham, David H. Chow, C. McGuire, David F. Brown, A. Kurdoghlian, M. Wetzel
Publikováno v:
2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).