Zobrazeno 1 - 1
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pro vyhledávání: '"Havva Eda Aysal"'
Autor:
V. Vinay K. Doddapaneni, Kijoon Lee, Havva Eda Aysal, Brian K. Paul, Somayeh Pasebani, Konstantinos A. Sierros, Chinedum E. Okwudire, Chih-hung Chang
Publikováno v:
Nanomaterials, Vol 13, Iss 16, p 2303 (2023)
Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM
Externí odkaz:
https://doaj.org/article/4cbe36d7ec5f4592964a75021d38e79e
