Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Hasnizah Aris"'
Publikováno v:
AIP Conference Proceedings.
Flip chip (FC) has been used to replace wire bond due to its better performance. The 1st interconnection in FC plays an important role in terms of reliability study. Au/Cu stud bump capped with Sn tends to have Kirkendall void in the joint which can
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7af8d69f58dfbb38d8169e5722289f32
https://doi.org/10.1063/1.5142118
https://doi.org/10.1063/1.5142118
Publikováno v:
AIP Conference Proceedings.
Breast cancer is one of the most common cancer and the leading cause of death among women. In the past, the simulation approach has been used to study, analyze and improve breast cancer early detection. Although there have been simulation work relate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c121bdff106b44637e61b9db56b6546
https://doi.org/10.1063/1.5142108
https://doi.org/10.1063/1.5142108
Autor:
Rajendaran Vairavan, Zaliman Sauli, W. M. W. Norhaimi, Hasnizah Aris, Mukhzeer Mohamad Shahimin, Vithyacharan Retnasamy
Publikováno v:
AIP Conference Proceedings.
Fringe projection has been garnering tremendous interest in the field of optical imaging. A wide range of surface measurement application including the medical application utilizes the fringe projection as means of surface metrology due to its non-in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5dea187716082df572ba0ecea99421a
https://doi.org/10.1063/1.5142107
https://doi.org/10.1063/1.5142107
Autor:
Hasnizah Aris, Mam Azmi, Rajendaran Vairavan, W. M. W. Norhaimi, K Wong, Zaliman Sauli, Vithyacharan Retnasamy, Mukhzeer Mohamad Shahimin
Publikováno v:
SPIE Future Sensing Technologies.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b51827ca8c546b87dfc86e59f7b0b4a9
https://doi.org/10.1117/12.2543049
https://doi.org/10.1117/12.2543049
Autor:
Zaliman Sauli, Vithyacharan Retnasamy, Rajendaran Vairavan, Mukhzeer Mohamad Shahimin, Hasnizah Aris, W. M. W. Norhaimi
Publikováno v:
Smart Biomedical and Physiological Sensor Technology XV.
The proximal interphalangeal joint (PIP) is the most important joint of the finger and is one of the most common joints to be affected by hand osteoarthritis (OA) due to excessive usage of the hand. PIP injury which may lead to osteoarthritis occurs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f22d2a4599059f32447701c8993a52c
https://doi.org/10.1117/12.2304770
https://doi.org/10.1117/12.2304770
Autor:
Zaliman Sauli, Vithyacharan Retnasamy, Rajendaran Vairavan, Hafiz Aziz, Hasnizah Aris, W. M. W. N. Haimi, Mukhzeer Mohamad Shahimin
Publikováno v:
Smart Biomedical and Physiological Sensor Technology XV.
Breast cancer is one of the fatal diseases and is one of the leading causes of death among women. Early screening for breast cancer is highly needed among women. Monitoring of the disease is also extremely vital for determining the best possible meth
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b0f105281e8756a6a72b93e037885c8e
https://doi.org/10.1117/12.2305230
https://doi.org/10.1117/12.2305230
Autor:
C. S. Foong, N. Khan, M. R. Lim, Hasnizah Aris, Zaliman Sauli, K. Muniandy, Vithyacharan Retnasamy, C. Lo
Publikováno v:
AIP Conference Proceedings.
First level interconnection is important to connect the circuits and the devices. For low input/ output (I/O), stud bump bonding (SBB) is preferable compared with Cu pillar. Cu wire is cheaper than Au wire and it is applicable in SBB for low I/O pin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::925742576859a8c8b45de4011d9cc292
https://doi.org/10.1063/1.5080908
https://doi.org/10.1063/1.5080908
Autor:
Hasnizah Aris, C. S. Foong, K. Muniandy, M. R. Lim, Zaliman Sauli, N. Khan, Vithyacharan Retnasamy, C. Lo
Publikováno v:
AIP Conference Proceedings.
Thermosonic bonding (TSB) and thermocompression bonding (TCB) are common interconnections technique in flip chip (FC). Both techniques are used in chip to chip interconnection and both have been studied in this paper. Coining and anisotropic conducti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7104f9c4e2ef4ad78d5fc84ecb61c0fa
https://doi.org/10.1063/1.5080906
https://doi.org/10.1063/1.5080906
Publikováno v:
EPJ Web of Conferences, Vol 162, p 01079 (2017)
This study proposes the investigation of two piezoelectric material namely PZT and Lanthanum Doped Barium Titanate (BaLaTiO3 ) performance as a vibration based energy harvester. The piezoelectric material when applied mechanical stress or strain prod
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::11806c24ffbe95ff660d4b90b0c991f3
https://doaj.org/article/02fee4227fb54a0d8c7849793cb83c4a
https://doaj.org/article/02fee4227fb54a0d8c7849793cb83c4a
Autor:
Josel B. Godezano, Delia B. Senoro, Zaliman Sauli, Lemmuel L. Tayo, Meng-Wei Wan, Hasnizah Aris
Publikováno v:
EPJ Web of Conferences, Vol 162, p 01081 (2017)
This paper discusses the effects of pH and concentration on the capability of E. coli ATCC29522 and S. epidermidis RP62A biofilm with bentonite in removing divalent copper, nickel and lead from wastewater. Batch adsorption study at laboratory scale w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::423933be78415920690febb33c8cbb35
https://doaj.org/article/f654cf0218f94207bde56804d10ccd01
https://doaj.org/article/f654cf0218f94207bde56804d10ccd01