Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Harry Schoeller"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:502-511
Publikováno v:
Journal of Electronic Materials. 49:226-240
The increased demand for microelectronic devices that function in hotter environments compels the study of Pb-free solders containing solid solution dispersoids (such as Bi and Sb), which are stable at significant concentrations in Sn at temperatures
Autor:
Junghyun Cho, Harry Schoeller
Publikováno v:
Materials Science and Engineering: A. 658:210-220
This work identifies a new superplastic alloy and proposes the responsible phenomenological model for superplastic flow based on mechanical characterization and microstructural observations. 85Pb–10Sb–5Sn exhibited unusual superplastic behavior i
Publikováno v:
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Predominant high melting point solders for high-temperature and harsh environment electronics (operating temperatures from 200 to 250 °C) are Pb-based systems, which are being subjected to RoHS regulations because of their toxic nature. In this stud
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:000364-000371
This work investigates the effect of Sn component surface finish on the melting temperature, microstructure, and mechanical behavior of 92.5Pb-5Sn-2.5Ag. 92.5Pb-5Sn-2.5Ag was doped with up to 7% Sn to simulate the final composition of a joint after r
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Predominant high melting point solders for high temperature electronics (operating temperatures over 200°C) are high Pb containing alloys. The new regulation will have banned the use of Pb in all electronics by 2019. We designed a "new" class of sol
Publikováno v:
Materials Science and Engineering: A. 528:1063-1070
This study examines the high temperature creep behavior of several Pb-based alloys. All compositions tested were found to follow power-law dislocation creep in the strain rate range of 10 −9 –10 −3 s −1 . Both the stress exponent and activati
Publikováno v:
Journal of Electronic Materials. 38:802-809
This study characterized the temperature-dependent constitutive parameters (yield strength, ultimate tensile strength, elastic modulus, strain hardening exponent) from the mechanical behavior of five high-temperature solders, 95Sn-5Sb, 95Pb-5In, 90Pb
Publikováno v:
Journal of Electronic Materials. 37:483-489
The fluxless solderability of pure indium on gold-coated surfaces is investigated in this study using measurements of wetting angle and joint strength. This study focuses on the effects of indium’s native oxides and those which form during heat tre
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).