Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Harrison Chung"'
Autor:
Harrison Chung, Ben-Je Lwo, Kuo-Hsin Huang, Yong-Cheng Lu, Jeff Kao, Robert Lee, Tzu-Yen Huang
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
This paper introduces two advanced high-power diode packaging designs, respectively named Z-type and A-type from the Zowie Technology Corp., and analyzes temperature and thermo-stress distributions in the two diode packaging structure. To this end, d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67692c5cadd4cf4c367fe23f56c9dbde
https://doi.org/10.1109/impact.2016.7800010
https://doi.org/10.1109/impact.2016.7800010
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:002377-002403
fcCSP packaging was historically based on solder interconnects. The continued drive towards higher I/O and shrinking package sizes has lead to very dense bump pitches which exceed those of CPUs. At area array bump pitches below 150 um, solder bumps r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::783487d3e1c84c766aba59aece4c01e7
https://doi.org/10.4071/2011dpc-tha32
https://doi.org/10.4071/2011dpc-tha32
Autor:
Annie Hu, Ben-Je Lwo, Zhong-Yi Wu, Harrison Chung, Jeff Kao, Pei-Hsuan Wu, Richard Chen, Robert Lee
Publikováno v:
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In this paper, we perform thermal and thermo-stress analyses on diode packaging with both currently used (traditional) and the newly designed (Zowie) structures in a 5W power adapter. To this end, a global-local methodology with ANSYS FEM software we
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d874515ebf73e8af34fd58c3b82da08
https://doi.org/10.1109/impact.2014.7048393
https://doi.org/10.1109/impact.2014.7048393
Autor:
Lwo Ben-Je, Zhong-Yi Wu, Harrison Chung, Jeff Kao, Annie Hu, Robert Lee, Pei-Hsuan Wu, Hao-Chun Tang, Richard Chen
Publikováno v:
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
To analyze thermal and thermo-stress behaviors of the diode packaging for high power applications, a global-local scheme through finite element simulations are performed in this study. To derive necessary boundary conditions and to verify the simulat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e582b47efdfa84a580fbaa47e0218fd7
https://doi.org/10.1109/impact.2013.6706643
https://doi.org/10.1109/impact.2013.6706643
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
Flip chip (fc) packaging has been practiced for many years but mainly for high end computer and certain automotive devices. RoHS has driven the conversion from lead-based fc bumps to lead-free (Pb-free) bumps. Pb-free was adopted more readily in cons
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f21035a7ab7f6e3bd797783b0599e89
https://doi.org/10.1109/eptc.2011.6184423
https://doi.org/10.1109/eptc.2011.6184423