Zobrazeno 1 - 10
of 39
pro vyhledávání: '"Harish K. Krishnamurthy"'
Autor:
Nachiket Desai, Han Wui Then, Jingshu Yu, Harish K. Krishnamurthy, William J. Lambert, Nicolas Butzen, Sheldon Weng, Christopher Schaef, Kaladhar Radhakrishnan, Krishnan Ravichandran, James W. Tschanz, Vivek De
Publikováno v:
IEEE Journal of Solid-State Circuits. 57:1090-1099
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04f11a0e5a92d2d19bac7fd94ded0c6d
https://doi.org/10.1109/jssc.2022.3141779
https://doi.org/10.1109/jssc.2022.3141779
Autor:
Youssef Elasser, Jaeil Baek, Kaladhar Radhakrishnan, Houle Gan, Jonathan Douglas, Vivek De, Shuai Jiang, Harish K. Krishnamurthy, Xin Li, Charles R. Sullivan, Minjie Chen
Publikováno v:
2023 IEEE Applied Power Electronics Conference and Exposition (APEC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fffb32bd8bd69d1aed1e5fc09d9e16d
https://doi.org/10.1109/apec43580.2023.10131163
https://doi.org/10.1109/apec43580.2023.10131163
Autor:
Harish K. Krishnamurthy, Steven K. Hsu, Chris H. Kim, Vivek De, Ram Krishnamurthy, Sriram R. Vangal, Somnath Paul, Amit Agarwal, Saurabh Kumar, James W. Tschanz
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 29:843-856
The system-on-chip (SoC) designs for future Internet of Things (IoT) systems, spanning client platforms to cloud datacenters, need to deliver uncompromising and scalable performance with extreme energy efficiency for diverse workloads and application
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8095319381f2b66b2404c846f36a82d7
https://doi.org/10.1109/tvlsi.2021.3061649
https://doi.org/10.1109/tvlsi.2021.3061649
Autor:
Xiaosen Liu, Vivek De, Sudhir K. Satpathy, Sanu Mathew, Harish K. Krishnamurthy, Krishnan Ravichandran, Himanshu Kaul, Vikram B. Suresh, Mark A. Anders, Raghavan Kumar
Publikováno v:
IEEE Journal of Solid-State Circuits. 56:1141-1151
A side-channel attack (SCA) hardened AES-128 and RSA crypto-processor in 14-nm CMOS with measured resistance to correlation power/electromagnetic analysis (CPA/CEMA) in both time and frequency domains is demonstrated. While previously reported linear
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce389ad2c6076698d39d2adadaa7b1b2
https://doi.org/10.1109/jssc.2021.3052146
https://doi.org/10.1109/jssc.2021.3052146
Autor:
Jin Feng, Kim Suhwan, Huong Do, Sheldon Weng, Vivek De, Harish K. Krishnamurthy, Kaladhar Radhakrishnan, James W. Tschanz, Krishnan Ravichandran, Sally Safwat Amin
Publikováno v:
IEEE Solid-State Circuits Letters. 4:234-237
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1312a41d74c3097854298b108ca50727
https://doi.org/10.1109/lssc.2021.3129157
https://doi.org/10.1109/lssc.2021.3129157
Autor:
Arijit Raychowdhury, Muya Chang, Shovan Maity, Dong-Hyun Seo, Josef Danial, Sanu Mathew, Harish K. Krishnamurthy, Anupam Golder, Shreyas Sen, Avinash L. Varna, Nirmoy Modak, Debayan Das, Santosh Ghosh, Baibhab Chatterjee
Publikováno v:
IEEE Journal of Solid-State Circuits. 56:136-150
Mathematically secure cryptographic algorithms, when implemented on a physical substrate, leak critical “side-channel” information, leading to power and electromagnetic (EM) analysis attacks. Circuit-level protections involve switched capacitor,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76db016b2dab92a869469f8d85692231
https://doi.org/10.1109/jssc.2020.3032975
https://doi.org/10.1109/jssc.2020.3032975
Autor:
Nachiket Desai, Harish K. Krishnamurthy, Suhwan Kim, Christopher Schaef, Sheldon Weng, Beomseok Choi, William J. Lambert, Krishnan Ravichandran, James W. Tschanz, Vivek De
Publikováno v:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::419d9a4d3a72602036ff63fcb4216b69
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830385
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830385
Autor:
Claudia P Barrera, Zakir K. Ahmed, Harish K. Krishnamurthy, Xiaosen Liu, Vivek De, Rajasekhara M. Narayana Bhatla, Scott Chiu, James W. Tschanz, Nachiket Desai, Krishnan Ravichandran, Jing Han
Publikováno v:
IEEE Solid-State Circuits Letters. 3:526-529
A dual-rail hybrid analog/digital low-dropout regulator (DRLDO) targeting heterogeneous integration in a multichip package (MCP) platform is presented. Different from the classic single-input–single-output low-dropout regulator (LDO) topology, whic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9973b7901f0570b48076f9e2f7445199
https://doi.org/10.1109/lssc.2020.3035675
https://doi.org/10.1109/lssc.2020.3035675
Autor:
William J. Lambert, Huong Do, Harish K. Krishnamurthy, Sheldon Weng, Nachiket Desai, Vivek De, Christopher Schaef, Kim Suhwan, Khondker Zakir Ahmed, Krishnan Ravichandran, Kaladhar Radhakrishnan, James W. Tschanz, Xiaosen Liu
Publikováno v:
IEEE Journal of Solid-State Circuits. 54:3316-3325
Fully integrated voltage regulators (FIVRs) offer many advantages, such as fine-grained power management, fast transient response, and reduced form factor. This article addresses light-load efficiency in FIVRs with nH-scale air-core inductors. The ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e43e2c51031c7a663f2d1766e86a16ae
https://doi.org/10.1109/jssc.2019.2946218
https://doi.org/10.1109/jssc.2019.2946218
Autor:
Sheldon Weng, Han Wui Then, Nidhi Nidhi, Christopher Schaef, Nicolas Butzen, Jingshu Yu, Marko Radosavljevic, Kaladhar Radhakrishnan, J. Sandford, William J. Lambert, Krishnan Ravichandran, Vivek De, Rode Johann Christian, Nachiket Desai, Sell Bernhard, Harish K. Krishnamurthy, James W. Tschanz
Publikováno v:
VLSI Circuits
A 5V-input, high-frequency, high-density (9A/mm2) buck converter featuring a low-voltage GaN power transistor (with 5-10× better FoM than Si) with on-die gate clamps, integrated with a CMOS companion die in 4mm × 4mm package, achieves 94.2% peak ef
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45f9990b191894cab43f14049c0d6881
https://doi.org/10.23919/vlsicircuits52068.2021.9492350
https://doi.org/10.23919/vlsicircuits52068.2021.9492350