Zobrazeno 1 - 10
of 92
pro vyhledávání: '"Haralampos Pozidis"'
Autor:
Andreea Anghel, Milos Stanisavljevic, Sonali Andani, Nikolaos Papandreou, Jan Hendrick Rüschoff, Peter Wild, Maria Gabrani, Haralampos Pozidis
Publikováno v:
Frontiers in Medicine, Vol 6 (2019)
Stain normalization is an important processing task for computer-aided diagnosis (CAD) systems in modern digital pathology. This task reduces the color and intensity variations present in stained images from different laboratories. Consequently, stai
Externí odkaz:
https://doaj.org/article/928ced48664f47e9b014964c9425d9bb
Multi-cloud computing has become increasingly popular with enterprises looking to avoid vendor lock-in. While most cloud providers offer similar functionality, they may differ significantly in terms of performance and/or cost. A customer looking to b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::49f08e61dbfd1676e91330f0a1024ad6
http://arxiv.org/abs/2204.09437
http://arxiv.org/abs/2204.09437
Publikováno v:
IEEE Transactions on Circuits and Systems II: Express Briefs. 68:844-850
Phase Change Memory (PCM) is a new nonvolatile memory technology that promises to disrupt current big data applications and even create entirely new ones. This is because it can serve as both fast storage and large memory, which is out of reach for i
Publikováno v:
Future Generation Computer Systems. 108:1173-1191
In this work we propose an asynchronous, GPU-based implementation of the widely-used stochastic coordinate descent algorithm for convex optimization. We define the class of problems that can be solved using this method, and show that it includes many
Publikováno v:
ISCAS
New coding schemes based on generalized concatenated codes are proposed for emerging nonvolative memory technologies. Key requirements are high code rate, low latency, high throughput and the ability to correct chipkill failures while sustaining high
Autor:
Nikolas Ioannou, Roman A. Pletka, Nikolaos Papandreou, Haralampos Pozidis, Ioannis Koltsidas, Thomas Parnell, Aaron D. Fry, Sasa Tomic, Timothy J. Fisher
Publikováno v:
ACM Transactions on Storage. 14:1-25
Despite its widespread use in consumer devices and enterprise storage systems, NAND flash faces a growing number of challenges. While technology advances have helped to increase the storage density and reduce costs, they have also led to reduced endu
Autor:
Aaron D. Fry, Patrick Breen, Nikolaos Papandreou, Radu Stoica, Timothy J. Fisher, Milos Stanisavljevic, Sasa Tomic, Thomas Parnell, Roman A. Pletka, Haralampos Pozidis, Gary A. Tressler, Andrew D. Walls, Nikolas Ioannou
Publikováno v:
IRPS
3D QLC NAND has recently entered the SSD market offering capacity increase and cost reduction compared to 3D TLC NAND. However, the endurance of QLC NAND is limited. Moreover, due to reduction of the available margin between the programmed threshold
Autor:
Sasa Tomic, Thomas Parnell, Nikolas Ioannou, Nikolaos Papandreou, Roman A. Pletka, Radu Stoica, Milos Stanisavljevic, Haralampos Pozidis
Publikováno v:
NVMTS
This paper discusses the reliability challenges of 3D NAND flash memory and their impact on flash management for enterprise storage applications. Emphasis is given to the read voltage calibration and its critical role in achieving low error-rates and
Autor:
Maria Gabrani, Milos Stanisavljevic, Nikolaos Papandreou, Andreea Anghel, Peter J. Wild, Sonali Andani, Jan Hendrick Rüschoff, Haralampos Pozidis
Publikováno v:
Frontiers in Medicine, Vol 6 (2019)
Frontiers in Medicine
Frontiers in Medicine
Stain normalization is an important processing task for computer-aided diagnosis (CAD) systems in modern digital pathology. This task reduces the color and intensity variations present in stained images from different laboratories. Consequently, stai
Autor:
Nikolas Ioannou, Thomas Parnell, Aaron D. Fry, Nikolaos Papandreou, Patrick Breen, Timothy J. Fisher, Haralampos Pozidis, Gary A. Tressler, Sasa Tomic, Roman A. Pletka
Publikováno v:
IRPS
3D NAND flash memory has entered dynamically into the space of enterprise server and storage systems, offering significantly higher capacity and better endurance than the latest 2D technology node. Moreover, the advancements in vertical stacking, cel