Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Haoyue Ji"'
Publikováno v:
Micromachines, Vol 15, Iss 4, p 422 (2024)
With the advancement of Moore’s Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced packa
Externí odkaz:
https://doaj.org/article/32d2d7622f2644e58e1738f39d59e27c
Publikováno v:
Micromachines, Vol 14, Iss 7, p 1345 (2023)
In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability of micro bumps, which plays an important role in mechanical support, electrical connection, signal transmission
Externí odkaz:
https://doaj.org/article/62c2784a54624b0ca66c5c14704ecc84
Publikováno v:
Micromachines, Vol 14, Iss 6, p 1255 (2023)
To meet the demands for miniaturization and multi-functional and high-performance electronics applications, the semiconductor industry has shifted its packaging approach to multi-chip vertical stacking. Among the advanced packaging technologies for h
Externí odkaz:
https://doaj.org/article/14d650c533c24627980e5da7b0c25d7b
Publikováno v:
Emotion. 23:1061-1074
Social directional cues (e.g., gaze direction; walking direction) can trigger reflexive attentional orienting, a phenomenon known as social attention. Here, we examined whether this reflexive social attention could be modulated by the emotional conte
Publikováno v:
Micromachines; Volume 14; Issue 7; Pages: 1345
In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability of micro bumps, which plays an important role in mechanical support, electrical connection, signal transmission
Publikováno v:
Micromachines; Volume 14; Issue 6; Pages: 1255
To meet the demands for miniaturization and multi-functional and high-performance electronics applications, the semiconductor industry has shifted its packaging approach to multi-chip vertical stacking. Among the advanced packaging technologies for h
Autor:
Maoguang Wang, Haoyue Ji
Publikováno v:
Procedia Computer Science. 202:164-171
Publikováno v:
International Conference on Mechanical Design and Simulation (MDS 2022).
Publikováno v:
Psychological science. 33(9)
Previous research has shown that social cues, including eye gaze, can readily guide our focus of attention—a phenomenon referred to as social attention. Here, we demonstrated that internally maintained social cues in working memory (WM) can produce
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).