Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Haohao Xia"'
Publikováno v:
Metals, Vol 14, Iss 10, p 1107 (2024)
With the rapid development of the advanced electronic packaging field, the requirements for the connection between solder and Cu substrate are becoming increasingly stringent. Currently, the commonly used Ni-P diffusion barrier layer in the industry
Externí odkaz:
https://doaj.org/article/ece7abe0158a4f90a2ce25c3911dcc4d
