Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Hao-Chih Chen"'
Publikováno v:
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Power modules are widely used to control and convert electrical power system, such as industrial, railway, and even electric vehicle applications. Higher operation temperature and high current density requests of power devices make it is more and mor
Publikováno v:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Power module reliability becomes more and more important than before, especially in the next generation power device. Electric vehicle applications and high temperature operation need better lifetime and environmental resistance. The encapsulated mat
Publikováno v:
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Power electronic modules, based on a range of semiconductor technologies are widely used to control and convert electrical power system, such as industrial, railway, and even electric vehicle applications. The most common technology of a die-level in
Publikováno v:
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Solder as an interconnection material is widely used in power semiconductor device. The solder reliability is a challenge in higher temperature operation. This paper provides a preliminary solder life prediction model based on thermo-mechanical finit
Publikováno v:
2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Higher operation temperature and high current density requests of new generation power devices make it is more and more complicated to meet the quality requirements for power electronic modules. Especially the (silicon carbide) SiC and gallium nitrid
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Technological developments and increasing user demand have driven the evolution of electronic packaging from traditional single-chip packaging to multi-chip packaging, i.e., three-dimensional integrated circuit (3D-IC) packaging. The main advantages
Autor:
Hao-Chih Cheng, 鄭豪志
96
This study aims to explore the relationships among cultural capital, social capital and matacognition to the self-directed learning readiness of adults. By reviewing literary, building the study on the basic theories. Questionnaire survey has
This study aims to explore the relationships among cultural capital, social capital and matacognition to the self-directed learning readiness of adults. By reviewing literary, building the study on the basic theories. Questionnaire survey has
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/83773979492711272178
Autor:
Hao-Chih Cheng, 鄭浩志
90
The coming of high-speed networking brings a juncture for new applications that need strict performance requirements. It is not difficult to prevision that provide a steady network for real-time transmission traffic to implement high requirem
The coming of high-speed networking brings a juncture for new applications that need strict performance requirements. It is not difficult to prevision that provide a steady network for real-time transmission traffic to implement high requirem
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/86925467595568429937
Autor:
Hao Chih Chen, 陳厚志
89
The development of technology of Internet makes the number of Internet users increase gradually. And many businesses have made Internet a newly developed channel to reach the market. It is important that distributors develop marketing strateg
The development of technology of Internet makes the number of Internet users increase gradually. And many businesses have made Internet a newly developed channel to reach the market. It is important that distributors develop marketing strateg
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/93214210740004364359