Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Hansel Dsilva"'
Autor:
Chrisenn Hansel Dsilva, Starlin Vijay Mythri, Sahej Arora, Sagar Karia, Avinash Desousa, M. S. Reddy
Publikováno v:
Annals of Indian Psychiatry, Vol 8, Iss 4, Pp 279-284 (2024)
Background: Comorbidity in obsessive–compulsive disorder (OCD) is known, especially alcohol use disorders (AUDs) in OCD. Data are lacking regarding the prevalence, the obsessions and compulsions in people with OCD with comorbid alcohol use. Aims an
Externí odkaz:
https://doaj.org/article/5790746fc48d4e3981ce6ff46d330331
Autor:
Hansel Dsilva, Elangovan N
Publikováno v:
Ushus Journal of Business Management. 20:27-43
Even though E-Commerce has been advanced fordecades, it is today's buzzword. The industry hasendured impressive growth since the last decade. Thebusiness context is fierce as big companies try to vanquishwhile small companies enter the space and inst
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a8ecb8893ee982da8b67e7c58253dc9
https://doi.org/10.12725/ujbm.57.3
https://doi.org/10.12725/ujbm.57.3
Autor:
Hansel Dsilva, Scott McMorrow, Steve Krooswyk, Beomtaek Lee, Adam Gregory, Richard I. Mellitz
Publikováno v:
2021 IEEE 25th Workshop on Signal and Power Integrity (SPI).
At higher data rate (50 Gbps+), there is a need to understand the different interconnect impairments that lead to margin degradation. This paper presents the impact of intra-pair skew from a magnitude and polarity perspective on the interconnect elec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f9fd3e6fb6f3d45f013a5a670a8517ff
https://doi.org/10.1109/spi52361.2021.9505171
https://doi.org/10.1109/spi52361.2021.9505171
Autor:
Chien-Ping Kao, Guo Jong-Ru, Jianting Li, Beomtaek Lee, Se-Jung Moon, Xinjun Zhang, Hansel Dsilva
Publikováno v:
2021 IEEE 25th Workshop on Signal and Power Integrity (SPI).
In the high-speed differential (HSD) interface design, the intra-pair skew becomes more critical as the link speed is ever increasing beyond 56Gbps+ signaling. The skew within a differential pair (intra-pair skew) deteriorates eye opening at the rece
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::56b9e25e5a6299d1d851ace3adce4f4e
https://doi.org/10.1109/spi52361.2021.9505188
https://doi.org/10.1109/spi52361.2021.9505188
Publikováno v:
2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
Today’s design of high data rate (25 Gbps+) channel calls out modeling of the package to printed circuit board interface using full-wave electromagnetic field solvers. The interaction of the package ball grid array and printed circuit board pad alo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14d9f4a906635d38541825f8d5c210ec
https://doi.org/10.1109/edaps50281.2020.9312900
https://doi.org/10.1109/edaps50281.2020.9312900
Publikováno v:
2019 IEEE MTT-S International Microwave and RF Conference (IMARC).
The power wave scattering matrix theory allows for maximum power transfer pertaining to zero reflections. The condition of zero reflections is not realizable through the traveling wave scattering matrix theory given the requirement for the reference
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b82f8f49d062775ff720c4e26361923
https://doi.org/10.1109/imarc45935.2019.9118701
https://doi.org/10.1109/imarc45935.2019.9118701
Publikováno v:
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).
High-speed VNA pico-probe calibration can be a very tedious process and is one of the most important and time consuming parts of collecting good S-parameter data. When performing multi-port probe calibrations using a calibration substrate, an operato
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f94286dcc0e217b6e5c43bf44fc76078
https://doi.org/10.1109/isemc.2019.8825195
https://doi.org/10.1109/isemc.2019.8825195
Publikováno v:
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).
For successful high-speed system design, accurate component characterization is essential. The component is often mounted on a printed circuit board (PCB) for the characterization. The removal of the fixture parasitic effects is critical. The fixture
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::94bdb0744b4794c2055500564c51875d
https://doi.org/10.1109/isemc.2019.8825192
https://doi.org/10.1109/isemc.2019.8825192
Publikováno v:
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
In today's high-speed interconnect design, crosstalk is a critical parameter and the accurate measurement is very important. However, in the calibration procedure, the fixture crosstalk is usually ignored to avoid over-complicated de-embedding algori
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c08c5637d2ac5fb70094b45b92ca2417
https://doi.org/10.1109/isemc.2017.8077925
https://doi.org/10.1109/isemc.2017.8077925
Autor:
Dsilva, Chrisenn Hansel1 (AUTHOR) drchrisenn@gmail.com, Mythri, Starlin Vijay2 (AUTHOR), Arora, Sahej1 (AUTHOR), Karia, Sagar1 (AUTHOR), Desousa, Avinash1 (AUTHOR), Reddy, M. S.3 (AUTHOR)
Publikováno v:
Annals of Indian Psychiatry. Oct-Dec2024, Vol. 8 Issue 4, p279-284. 6p.