Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Hans-Juergen Funke"'
Autor:
April Joy Garete, Zhiwen Li, Billie Xianghong Bi, Hans-Juergen Funke, Kwong Cheung Lee, Haibin Chen
Publikováno v:
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9f7b8247fc47fe5a8fb78b89ad3586c
https://doi.org/10.1109/impact53160.2021.9696468
https://doi.org/10.1109/impact53160.2021.9696468
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
It is widely believed that wedge crack is resulted from thermal stress occurring at wire bonding area due to coefficient of thermal expansion(CTE) mismatches among epoxy molding compound (EMC), bonding wire and Leadframe(LF). Wedge bond heel area has
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ef91d940994bced3ca71c092be3c6f0
https://doi.org/10.1109/impact50485.2020.9268559
https://doi.org/10.1109/impact50485.2020.9268559
Autor:
Benjamin März, Michael Rother, Tina Li, Kan Lee, Hans-Juergen Funke, Robert Klengel, Mandy Ullrich, Mark Luke Farrugia, Karina Leung, Tim Boettcher, Martin Li, Orla O'Halloran, Andreas Pinkernelle, Matthias Petzold, Michael Kaiser, Stefan Liedtke, Marc Bollmann, Daniel Gruber
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
A detailed description of the Cu-Al wire bond interface is presented, which can possibly explain the often observed corrosion failures in humidity reliability tests. Using micro-structural analysis techniques, it is shown that the unstressed interfac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1e10ff42133020288220649e990d270
https://doi.org/10.1109/eptc.2010.5702706
https://doi.org/10.1109/eptc.2010.5702706