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pro vyhledávání: '"Hans-Joachim Möller"'
Autor:
Hans Joachim Möller
Publikováno v:
Handbook of Photovoltaic Silicon ISBN: 9783662527351
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7512868640b0dc3cc6f970a6d6c5c553
https://doi.org/10.1007/978-3-662-56472-1_18
https://doi.org/10.1007/978-3-662-56472-1_18
Autor:
Hans-Joachim Möller
Publikováno v:
Handbook of Photovoltaic Silicon ISBN: 9783662527351
Artificially grown crystals have to be cut into wafers for further applications. The current wafering techniques are described with a major focus on the dominant multi-wire sawing method. After sawing the wafers may have to be further treated by grin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c0b10dbcd84e49d61306a0f4c3915d02
https://doi.org/10.1007/978-3-662-52735-1_16-1
https://doi.org/10.1007/978-3-662-52735-1_16-1
Publikováno v:
Solar Energy Materials and Solar Cells. 142:24-28
The potential induced degradation (PID) of silicon solar modules was investigated in detail in the past years. Nevertheless, even new PV installations exhibit a significant power loss of the system due to PID damage. In this contribution, thermograph
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0bc94f8704bef5196970898696b37fea
https://doi.org/10.1016/j.solmat.2015.05.028
https://doi.org/10.1016/j.solmat.2015.05.028
Publikováno v:
Solid State Phenomena. 242:466-471
Mechanical preparation of mono-and multicrystalline silicon wafers by sawing, lapping, or grinding damages the surface. Depending on the mechanical impact of the treatment different degrees of damage structures occur. It is necessary for further proc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0bd283f984184e10f204853f467da9d7
https://doi.org/10.4028/www.scientific.net/ssp.242.466
https://doi.org/10.4028/www.scientific.net/ssp.242.466
Publikováno v:
Energy Procedia. 77:881-890
The sawing of silicon wafers with diamond coated wires still requires further development for a widespread application in the photovoltaic industry. The technique has the potential for a cost reduction due to higher cutting rates and the use of water
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::60813e004b647e3a1489f12728b80d0c
Publikováno v:
physica status solidi c. 12:1119-1122
The fracture strength of silicon wafers used for photovoltaic and microelectronic applications mainly depends on the damage structure, which is introduced on the surface during processing of the wafers. The present paper investigates the formation an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e88e42f52c529d3ca2bf4bf1de335aa7
https://doi.org/10.1002/pssc.201400227
https://doi.org/10.1002/pssc.201400227
Autor:
Gaute Stokkan, Alexander Ulyashin, Arjan Ciftja, Eivind Øvrelid, Rajko Buchwald, Sindy Würzner, Hans Joachim Möller
Publikováno v:
physica status solidi (a). 212:25-29
The purpose of this work is to verify the possibility to process highly doped Si supporting substrates using a 2-step process: (i) sintering of a low-cost Si powder based ingot using hot pressing and a ELKEM Silgrain material as a feedstock; and (ii)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6911caa9100f6b8ccf1e38e68e7b3404
https://doi.org/10.1002/pssa.201431782
https://doi.org/10.1002/pssa.201431782
Publikováno v:
Energies; Volume 10; Issue 4; Pages: 414
A detailed approach to evaluate the sub-surface damage of diamond wire-sawn monocrystalline silicon wafers relating to the sawing process is presented. Residual stresses, the presence of amorphous silicon and microcracks are considered and related to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8644f2dc06f8cbf9af86f15d47c53b2e
https://publica.fraunhofer.de/handle/publica/249128
https://publica.fraunhofer.de/handle/publica/249128
Autor:
Kirsten Sunder, Toni Lehmann, Sindy Würzner, Hans Joachim Möller, Kilian Frohlich, Rajko Buchwald
Publikováno v:
Energy Procedia. 38:901-909
The usage of diamond-plated wire to produce silicon wafers for the photovoltaic industry is still a new and highly investigated wafering technology. The requirements regarding the quality of the wafer surface are very high and they have to compete wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ffc90f00dd6d59fc3c63724b821715bd
https://doi.org/10.1016/j.egypro.2013.07.363
https://doi.org/10.1016/j.egypro.2013.07.363
Publikováno v:
Surface and Interface Analysis. 45:781-786
For many semiconductor and photovoltaic applications the quality of substrate surfaces is an important requirement for thedevelopment of new devices. Therefore, methods are needed to analyse the surface structure in detail. In the following a newmeth
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0154bf927559c30b3f86dc2d0ee2cce0
https://doi.org/10.1002/sia.5169
https://doi.org/10.1002/sia.5169