Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Hans Leichtfried"'
Autor:
Hans Leichtfried, Manuel W. Thesen, Martin Messerschmidt, Michael J. Haslinger, Sonja Kopp, Tina Mitteramskogler, Michael Mühlberger
Publikováno v:
Nanotechnology. 31(34)
In this work, we present a fabrication procedure of metal nanomesh arrays with the newly developed nanoimprint resist mr-NIL212FC used in a bi-layer resist system for a lift-off process. We comparatively analyzed and evaluated nanomeshes fabricated w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ad97ce370d6ee42549a47627d8cb6219
https://pubmed.ncbi.nlm.nih.gov/32380487
https://pubmed.ncbi.nlm.nih.gov/32380487
Autor:
Dieter Holzinger, Thomas Faury, Iurii Gnatiuk, Josef Innerlohinger, Thomas Obermüller, Thomas Lederer, Eva Liftinger, Julia Kastner, Michael J. Haslinger, Helene M. Außerhuber, Hans Leichtfried
Publikováno v:
Microelectronic Engineering. 176:84-88
Silver is the material of choice for printed electronics. However, dispersed silver particles can block the fine nozzles of an inkjet print head and after printing the patterns have to be sintered at elevated temperatures to provide high conductivity
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48fd0a51d8462aa9950e6cefb2d72ebb
https://doi.org/10.1016/j.mee.2017.02.004
https://doi.org/10.1016/j.mee.2017.02.004
Autor:
Anna Klukowska, Ch. Ebm, Rainer Schöftner, Hans Leichtfried, Michael Mühlberger, E. Platzgummer, Iris Bergmair, Gabi Grützner, H. Loeschner, Anett Kolander
Publikováno v:
Microelectronic Engineering. 86:691-693
The use of working stamps for nanoimprint lithography is highly interesting for a number of reasons like an increased lifetime and often a better manufacturability of the master stamp. We present results on the use of Ormostamp as a material for work
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8d7e4f28980fcab15cd17cad48dca51
https://doi.org/10.1016/j.mee.2008.11.020
https://doi.org/10.1016/j.mee.2008.11.020