Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Hannes Stahr"'
Publikováno v:
IEEE Open Journal of Power Electronics, Vol 4, Pp 549-560 (2023)
This article presents a printed circuit board (PCB) -embedded 1.2 kV silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) half-bridge package for a 22 kW electric vehicle (EV) on-board charger (OBC). The package meets the
Externí odkaz:
https://doaj.org/article/ec5a5f477f944457bfea01e6253320e4
Publikováno v:
IEEE Transactions on Power Electronics. 37:11927-11936
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3a4b1c6c9816caa06456d39fdaa721a
https://doi.org/10.1109/tpel.2022.3177369
https://doi.org/10.1109/tpel.2022.3177369
Publikováno v:
2021 IEEE Energy Conversion Congress and Exposition (ECCE).
This work presents a PCB-embedded silicon carbide (SiC) MOSFET half-bridge module with low loop inductances, double-sided cooling, and integrated gate driver. 1.2 kV SiC MOSFET die are embedded in FR4 using a process developed by AT&S and are electri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48ddcde5851737d37801d19b4ef8be5b
https://doi.org/10.1109/ecce47101.2021.9596034
https://doi.org/10.1109/ecce47101.2021.9596034
Publikováno v:
2017 40th International Spring Seminar on Electronics Technology (ISSE).
Embedding technology enables miniaturisation of electric and electronic components together with improved reliability and thermal stability in harsh environment. This work investigates in form of single case studies the environmental performance from
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6147a9910aa24112696873634c71fe17
https://doi.org/10.1109/isse.2017.8000961
https://doi.org/10.1109/isse.2017.8000961
Publikováno v:
2017 40th International Spring Seminar on Electronics Technology (ISSE).
An entirely novel multilayer printed circuit board technology called EmPower allows embedding of chip components like power diodes, MOSFETs (Metal-oxide Semiconductor Field Effect Transistors) or IGBTs (Insulated Gate Bi-polar Transistors) at a signi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::953f95f1e5de2f70b2846553586bc714
https://doi.org/10.1109/isse.2017.8000901
https://doi.org/10.1109/isse.2017.8000901
Autor:
Elisabete Fernandes, Hannes Stahr, Andre Cardoso, Timo Schwarz, Michel Brizoux, Aurelien Lecavelier Des Etangs-Levallois
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC).
There is no doubt that component embedding technology becomes more visible in handheld applications like smart phones and wearables. Embedding technology is pushing the miniaturization which is a must for the next big wave of Wearable Electronics and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::540be587790af662c1f7d92e9dc58db0
https://doi.org/10.1109/estc.2016.7764464
https://doi.org/10.1109/estc.2016.7764464
Publikováno v:
2016 39th International Spring Seminar on Electronics Technology (ISSE).
A novel double diode package (footprint D2PAK compatible) was designed, simulated, and fabricated using an innovative embedding process with electroplated large-area copper contact metallizations on both sides of the chip. The package was also experi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0cda7d474ca276f09e4a7db176301246
https://doi.org/10.1109/isse.2016.7563169
https://doi.org/10.1109/isse.2016.7563169
Publikováno v:
2007 30th International Spring Seminar on Electronics Technology (ISSE).
The pressure towards increasing miniaturization and interconnection density forces the printed circuit board (PCB) manufacturers to integrate electronic components into multilayer PCBs. Goal of this work was a thorough thermal investigation of the th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::19f751ca9bd64a7b05b6781c58b7c04e
https://doi.org/10.1109/isse.2007.4432819
https://doi.org/10.1109/isse.2007.4432819