Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Hannes Greve"'
Autor:
Hannes Greve, Jann Lay
Publikováno v:
Journal of the Association of Environmental and Resource Economists. 10:121-158
Publikováno v:
Environment and Development Economics
The vulnerability of small firms to price shocks may partly explain why fossil fuel subsidy removals in developing countries are so difficult to implement. This paper analyzes the effects of fuel and electricity price increases on profits of micro- a
Autor:
Mahjabin Maksud, Hannes Greve, Daniel Pantuso, Chetan Prasad, K. W. Park, Benjamin J. Orr, Peng Bai, I-chen Ho, Steven R. Novak, Zhizheng Zhang, D. Ingerly, Michael P. O'Day, Cheyun Lin, Enamul Kabir, Emre Armagan, Sunny Chugh, Patrick N. Stover, Lance C. Hibbeler, A. Schmitz, Hsinwei Wu
Publikováno v:
IRPS
This work presents silicon reliability characterization of Intel’s Foveros three-dimensional (3D) logic-on-logic stacking technology implemented on the 22FFL process node. Simulations and data demonstrate mechanical strain safe zones around Through
Publikováno v:
Energy Economics. 72:222-235
We analyse the effects of environmental taxes on welfare and carbon emissions at the household level for the case of Mexico. The integrated welfare-environmental analysis, which is based on a censored energy consumer demand system, extends previous w
Autor:
Hannes Greve, F. Patrick McCluskey
Publikováno v:
2017 IEEE International Workshop On Integrated Power Packaging (IWIPP).
Transient Liquid Phase Sintering (TLPS) is a novel high power density module and high temperature electronics interconnect technology. The copper-tin (Cu-Sn) TLPS system is of particular interest because of its fast process completion, high melting t
Publikováno v:
Microelectronics Reliability. 54:1680-1685
Driven by consumer markets and industrial needs, power electronic systems are operating at higher power densities, in smaller packages and in more exotic environments. As these trends continue, ensuring long-term operation in harsher conditions requi
Autor:
F. Patrick McCluskey, Hannes Greve
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 11:7-15
Low temperature transient liquid phase sintering (LT-TLPS) can be used to form high-temperature joints between metallic interfaces at low process temperatures. In this paper, process analysis and shear strength studies of paste-based approaches to LT
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:000355-000363
Low-temperature transient liquid phase sintering (LT-TLPS) can be used to form high-temperature joints between metallic interfaces at low process temperatures. In this paper, we will describe the processing and shear strength, along with the shock fa
Publikováno v:
SSRN Electronic Journal.
We analyse the effects of environmental taxes on welfare and carbon emissions at the household level for the case of Mexico. The integrated welfare-environmental analysis, which is based on a censored energy consumer demand system, extends previous w
Autor:
F. Patrick McCluskey, Hannes Greve
Publikováno v:
International Symposium on Microelectronics. 2013:000951-000956
Low Temperature Transient Liquid Phase Sintering (LT-TLPS) enables the formation of joints robust to high temperatures at low process temperatures. TLPS systems consist of one or more low temperature constituents (i.e. Sn) and one or more high temper