Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Han-Tang Hung"'
Autor:
Chin-Hao Tsai, Han-Tang Hung, Fu-Ling Chang, Steffen Bickel, Maik Müller, Iuliana Panchenko, Karlheinz Bock, C.R. Kao
Publikováno v:
Journal of Materials Research and Technology, Vol 19, Iss , Pp 2510-2515 (2022)
Sn/In–Sn bonding interfaces obtained by the transient liquid phase (TLP) reaction were investigated for applications in low-temperature assembly. Bonding was achieved at temperatures below 150 °C with a low bonding pressure. Although a few voids w
Externí odkaz:
https://doaj.org/article/bde3abed5e674d75829b65c5057afe1b
Publikováno v:
Materials, Vol 16, Iss 18, p 6263 (2023)
Indium is considered a candidate low-temperature solder because of its low melting temperature and excellent mechanical properties. However, the solid-state microstructure evolution of In with different substrates has rarely been studied due to the s
Externí odkaz:
https://doaj.org/article/ad8eeb9576934420b47d9535e8ba2f87
Publikováno v:
Materials, Vol 16, Iss 9, p 3290 (2023)
Eutectic In-48Sn was considered a promising candidate for low-temperature solder due to its low melting point and excellent mechanical properties. Both Cu2(In,Sn) and Cu(In,Sn)2 formation were observed at the In-48Sn/Cu interface after 160 °C solder
Externí odkaz:
https://doaj.org/article/33b6aea267ea46b08aeb967a8884c892