Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Han-Lin Chung"'
Autor:
Han-Lin Chung, 鐘涵琳
98
The Cu/solder/Ni structure is a common joint configuration used in microelectronic packages today. In the operation of this joint structure at high temperatures, an appreciable amount of Cu can readily diffuse across the entire solder to the
The Cu/solder/Ni structure is a common joint configuration used in microelectronic packages today. In the operation of this joint structure at high temperatures, an appreciable amount of Cu can readily diffuse across the entire solder to the
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/32212520068776655287
Autor:
Chen, Cheng-Yi1,2 (AUTHOR) ricechen@hotmail.com, Lin, Meng-Wei3 (AUTHOR) lmw1018@nycu.edu.tw, Xie, Xing-Yang3 (AUTHOR) josedulcimer@gmail.com, Lin, Cheng-Han3 (AUTHOR) a0975273923@gmail.com, Yang, Chung-Wei4 (AUTHOR) yang.chung.wei@gmail.com, Wu, Pei-Ching5,6 (AUTHOR) d36619@mail.cmuh.org.tw, Liu, Dung-Huan5,7 (AUTHOR) d35345@mail.cmuh.org.tw, Wu, Chih-Jen8,9 (AUTHOR) wcj@mmh.org.tw, Lin, Chih-Sheng3,5,10 (AUTHOR) wcj@mmh.org.tw
Publikováno v:
International Journal of Molecular Sciences. Jan2024, Vol. 25 Issue 1, p329. 18p.
Autor:
Cheng, Kai‐Pi1 (AUTHOR), Yang, Yao‐Jong2,3 (AUTHOR), Hung, Hao‐Chang1,4 (AUTHOR), Lin, Ching‐Han1,3 (AUTHOR), Wu, Chung‐Tai3,5 (AUTHOR), Hung, Mei‐Hui6 (AUTHOR), Sheu, Bor‐Shyang3,5,7 (AUTHOR), Ou, Horng‐Yih1 (AUTHOR) wahoryi@mail.ncku.edu.tw
Publikováno v:
Journal of Diabetes Investigation. Jul2019, Vol. 10 Issue 4, p1092-1101. 10p.
Autor:
Chen, Yi-Fen1 (AUTHOR) anice720@gmail.com, Liu, Chung-Ji1,2 (AUTHOR) cjliu@ms2.mmh.org.tw, Lin, Li-Han2 (AUTHOR) volkdeskkimo@yahoo.com.tw, Chou, Chung-Hsien1 (AUTHOR) michaelchou0806@gmail.com, Yeh, Li-Yin1 (AUTHOR) liyin.yeh@gmail.com, Lin, Shu-Chun1,3,4 (AUTHOR) sclin@ym.edu.tw, Chang, Kuo-Wei1,3,4 (AUTHOR) ckcw@ym.edu.tw
Publikováno v:
BMC Cancer. 3/29/2019, Vol. 19 Issue 1, p1-11. 11p. 5 Color Photographs.
Publikováno v:
Frontiers in Oncology; 11/29/2021, Vol. 11, p1-15, 15p
Autor:
Lin, Chun-Han1, Chen, Chung-Hui1, Yao, Yu-Feng1, Su, Chia-Ying1, Shih, Pei-Ying1, Chen, Horng-Shyang1, Hsieh, Chieh1, Kuo, Yang2, Kiang, Yean-Woei ywkiang@ntu.edu.tw, Yang, C. ccycc@ntu.edu.tw
Publikováno v:
Plasmonics. Oct2015, Vol. 10 Issue 5, p1029-1040. 12p.
Publikováno v:
Diabetes Week; 1/22/2024, p299-299, 1p
Publikováno v:
2014 International Conference on Information Science, Electronics & Electrical Engineering; 2014, p1-10, 10p
Publikováno v:
Women's Health Weekly; 3/2/2023, p434-434, 1p
Autor:
Lee, Liang-Teh, Li, Kuan-Ching, Yang, Chao-Tung, Tseng, Chia-Ying, Liu, Kang-Yuan, Hung, Chih-Hung
Publikováno v:
Advances in Multimedia Information Processing - PCM 2004 (9783540239857); 2005, p697-704, 8p