Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Han-Kyun Shin"'
Autor:
Hyo-Jong Lee, Seong-Jin Kim, Sang-Hyeok Kim, Hyun Park, Han-Kyun Shin, Seongjae Moon, Cheol-Ho Heo
Publikováno v:
Korean Journal of Metals and Materials. 59:233-238
To manufacture finer solder bumps, the SR and DFR patterns were filled using a Sn electroplating process instead of the microball process currently used in BGA technology, and the solder bump shape was fabricated through a reflow process. The microst
Publikováno v:
Journal of The Electrochemical Society. 169:102502
Copper (Cu) foils are used as anode current collectors in secondary batteries and to increase their capacity thin foils 8 μm thick, or less, have been commercialized. The change of mechanical properties according to the thickness of the foils was in
Autor:
Hyo-Jong Lee, Sang-Hyuk Kim, Han-Kyun Shin, Chae-Min Park, Dong-Uk Kim, Pil-Ryung Cha, Ui-hyoung Lee
Publikováno v:
Korean Journal of Metals and Materials. 53:495-499
Publikováno v:
Electronic Materials Letters. 11:695-701
Pad discoloration is caused by Ni corrosion during electroless nickel immersion gold (ENIG) treatment, and here it was investigated by SEM, XPS and cross-sectional EDS analysis. Interestingly, we found that the corrosion occurred at two different sit
Autor:
Hee-Jae Kang, Seok-Hwan Huh, Hyo-Jong Lee, Han-Kyun Shin, Jung-Min Kim, Jang-Hyun Sung, Junghwan Lee, Heajeong Lee
Publikováno v:
Surface and Coatings Technology. 240:221-225
Microstructure and composition analysis was performed on the nitrided Ti–6Al–4V alloy by using coupled techniques of X-ray diffraction analysis and glow discharge spectroscopy. Titanium nitride (TiN x ) appeared at the outmost surface, but the lo
Publikováno v:
Electronic Materials Letters. 11:915-915
Autor:
Ui-Hyoung Lee, Hyo-Jong Lee, Sang-Hyuk Kim, Chae-Min Park, Han Kyun Shin, Jong-yong Bae, Jaihyung Won
Publikováno v:
ECS Meeting Abstracts. :1711-1711
Anisotropic behavior of Sn based solder during electromigration has been studied by many researchers, and it is very important to control the microstructure for more reliable bump joints[1]. Here, we prepared various SnAg bumps with different Ag conc