Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Han-Jung Wang"'
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1.
The characteristic of MEMS component is affected by different process procedures such as depositing and etching thin films on substrate. These processes might induce residual stresses or deformations in MEMS component, which will reduce its efficienc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c6a408d625875f9fd40a695a7431cbe6
https://doi.org/10.1115/ipack2011-52201
https://doi.org/10.1115/ipack2011-52201
Publikováno v:
Volume 4: Electronics and Photonics.
In this study, the thermo-mechanical finite element (FE) analysis of the 3D chip stacking packaging is accomplished by employing the commercial software, ANSYS®. After manufacturing process, the thickness of the deposited material becomes variable.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::171a2110e2117eb9c8e684d64570a474
https://doi.org/10.1115/imece2010-40158
https://doi.org/10.1115/imece2010-40158