Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Han Shunfeng"'
Publikováno v:
Journal of Physics: Conference Series; Oct2023, Vol. 2645 Issue 1, p1-11, 11p
Autor:
Lijuan Bai, Dameng Li, Bofu Li, Dejian Li, Huimin He, Yubo Wang, Han Shunfeng, Liqiang Cao, Fengman Liu, Qi Zheng
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
As a basic component of optical communication network, the speed of optical modules is evolving towards 56G bit/s, which brings a great challenge to the signal integrity of interconnect structures. At present, optical chip and PCB board or substrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30c1caede8991f57c14b7a2d79979e79
https://doi.org/10.1109/icept52650.2021.9567999
https://doi.org/10.1109/icept52650.2021.9567999
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
in this paper, a kind of high-speed multi-function chip is packaged. Different from the general chip, the chip includes multiple high-speed parts and extremely high-density pins. Based on the package of the chip, a multi-dimension codesign method is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76f385c327e1cba524e83c268753e206
https://doi.org/10.1109/icept52650.2021.9567950
https://doi.org/10.1109/icept52650.2021.9567950
Publikováno v:
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
The package of the High-end Relay Protection Chip is Wire Bonding BGA (WBBGA) with 257 inputs/outputs (I/Os). This paper investigated the thermal performance of the High-end Relay Protection Chip using a computational fluid dynamics (CFD) tool. First
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::580a58c573259fd2513b4e26fbb57489
https://doi.org/10.1109/icept47577.2019.245115
https://doi.org/10.1109/icept47577.2019.245115
Publikováno v:
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
In this paper, a novel new package solution for CMOS image sensor (CIS) based on molding compound interconnect substrate (MIS) is proposed. First, a 13 million pixel CIS packaged by quad flat no lead (QFN) is chosen as a reference. Considering the de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1235ac7eeb6f0112f9f68b57421b06d8
https://doi.org/10.1109/icept.2016.7583333
https://doi.org/10.1109/icept.2016.7583333
Autor:
Jianna Zheng, Daoguo Yang, Deng Riyang, Miao Cai, Xie Dongji, Boyi Wu, Li Nanbo, Han Shunfeng
Publikováno v:
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
The pin-pull test is appealing because it can obtain a very high percentage of laminate cracking failures. In this paper, a pin-pull tester using a promoted soldering method is designed and manufactured. The improved pin soldering process is provided
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0bb1bd4e66f79ecde2cd52bba916dd2
https://doi.org/10.1109/icept.2015.7236794
https://doi.org/10.1109/icept.2015.7236794
Publikováno v:
2015 IEEE International Conference on Mechatronics and Automation (ICMA).
Microwave detection technology is one synthesis method involved in physics, electronics and microwave measurement technology. This technique is established on the basis of the electromagnetic characteristics of the media and the physical properties o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a5b457e46d6241210586da286c5f7c5
https://doi.org/10.1109/icma.2015.7237500
https://doi.org/10.1109/icma.2015.7237500
Publikováno v:
Proceedings of SPIE; 8/5/2023, Vol. 12614, p1261407-1261407, 1p
Autor:
Han, Shunfeng, Du, Min
Publikováno v:
2015 IEEE International Symposium on Systems Engineering (ISSE); 2015, p1-6, 6p
Publikováno v:
2015 IEEE International Conference on Mechatronics & Automation (ICMA); 2015, p297-302, 6p