Zobrazeno 1 - 10
of 48
pro vyhledávání: '"Han Seo Cho"'
Publikováno v:
Journal of Lightwave Technology. 26:1479-1485
An architecture of a passively assembled optical platform is suggested for a chip-to-chip optical interconnection system. The platform is constructed using all-fiber media for the optical paths: a fiber-embedded optical printed-circuit board (OPCB) a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c98e300aa23ad9c7728604e80ba49220
https://doi.org/10.1109/jlt.2008.922166
https://doi.org/10.1109/jlt.2008.922166
Publikováno v:
Microelectronics Reliability. 48:739-743
There have been strong demands for a miniaturization and multi-functionalities in the recent electronics, especially in the portable ones. To meet both requirements, passive and/or active devices embedding into PCBs have been regarded as a most promi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62a50a81dfb8208f20a0c5d0ece10a2f
https://doi.org/10.1016/j.microrel.2007.12.006
https://doi.org/10.1016/j.microrel.2007.12.006
Autor:
Han Seo Cho, Hyo-Hoon Park, Jung-Hwan Choi, Seong-Ook Park, Jung-Sub Lee, Kun-Mo Chu, Duk Young Jeon
Publikováno v:
IEEE Transactions on Advanced Packaging. 29:409-414
This paper describes low-temperature flip-chip bonding for both optical interconnect and microwave applications. Vertical-cavity surface-emitting laser (VCSEL) arrays were flip-chip bonded onto a fused silica substrate to investigate the optoelectron
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d38d0660d9d3f7cb798121b1b366656d
https://doi.org/10.1109/tadvp.2006.875417
https://doi.org/10.1109/tadvp.2006.875417
Autor:
Jang-Joo Kim, Byung Sup Rho, Joon-Sung Kim, Hyo-Hoon Park, Sae-Kyoung Kang, Kun-Mo Chu, Han Seo Cho, Weon Hyo Kim, Sung Hwan Hwang
Publikováno v:
IEEE Transactions on Advanced Packaging. 28:114-120
An optical interconnection plate was developed in order to achieve a compact and cost-effective interconnection module for an optical data link between chips on printed circuit boards. On the silica substrate, transmission lines and solder bumps are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::693eb65fafc887219b4ed4847ab134fb
https://doi.org/10.1109/tadvp.2004.842291
https://doi.org/10.1109/tadvp.2004.842291
Publikováno v:
Optics and Lasers in Engineering. 42:503-509
A simple method is presented to approximate the coupling efficiency in optical interconnection systems, which are affected by alignment parameters of various optical elements. The method considers geometric effects of alignment parameters, not consid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4c680cc4e0706f1bfa7d1ebe7202de9
https://doi.org/10.1016/j.optlaseng.2004.02.002
https://doi.org/10.1016/j.optlaseng.2004.02.002
Publikováno v:
Journal of Lightwave Technology. 22:2128-2134
In this paper, a new architecture for a chip-to-chip optical interconnection system is demonstrated that can be applied in a waveguide-embedded optical printed circuit board (PCB). The experiment used 45/spl deg/-ended optical connection rods as a me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7cfdd074807ebd5872b3b647776e5069
https://doi.org/10.1109/jlt.2004.833533
https://doi.org/10.1109/jlt.2004.833533
Autor:
Sang-Won Ha, Kyoung Up Shin, Han Seo Cho, Sun Tea Jung, Byoung-Ho Rhee, Hyo-Hoon Park, Sae-Kyoung Kang, Byung Sup Rho, Taeil Kim, Dong Su Kim, Mu Hee Cho
Publikováno v:
Journal of Micromechanics and Microengineering. 14:1181-1184
We fabricated fiber-embedded boards using a micro-grooving technique for optical interconnects. This approach is quite cost effective and fully compatible with conventional PCB processes. U-shaped grooves were formed on FR-4 plates using a 90? V-shap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1553cb59f9eab02f20e450571024775b
https://doi.org/10.1088/0960-1317/14/8/009
https://doi.org/10.1088/0960-1317/14/8/009
Publikováno v:
Journal of Materials Science. 35:4533-4537
Effects of the nitrogen addition on high temperature tensile properties and creep resistance of the fully lamellar and the duplex Ti-48.5Al-1.5Mo (at.%) alloy were investigated. High temperature yield strength of the nitrogen-doped alloys increased d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd1c5cfa2f1ec21b2d3e92aa722c16a3
https://doi.org/10.1023/a:1004864520426
https://doi.org/10.1023/a:1004864520426
Publikováno v:
Metals and Materials. 4:33-37
Constant tensile stress creep tests under the condition of 760~816°C/172~276 MPa in an air environment are conducted, and the microstructural evolution during primary creep deformation at the creep condition of 816°C/172 MPa was observed by transmi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a0dc7e82d3769b222ab85cb9f810eeb
https://doi.org/10.1007/bf03026062
https://doi.org/10.1007/bf03026062
Autor:
Kyoung-Up Shin, Han Seo Cho, Sung Hwan Hwang, Sang-Won Ha, Sang-Hoon Kim, Mu Hee Cho, Hyo-Hoon Park, Sae-Kyoung Kang
Publikováno v:
IEEE Photonics Technology Letters. 18:652-654
We propose a passively assembled chip-to-chip optical interconnection system using fiber-optic technology. To demonstrate the system, three components were prepared: a fiber-embedded optical printed-circuit board (OPCB), optical transmitter/receiver
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4704dc14d15d9284c785eaebb59192d
https://doi.org/10.1109/lpt.2006.870127
https://doi.org/10.1109/lpt.2006.870127