Design and characterization of thermal conductive wafer coating in thin small outline package for automotive product application.

Autor: Hamid, Azhar Abdul, Periathamby, Dhanapalan, Azizan, Suhaimi, Tan, Chee Eng, Nadarajan, Siva Kumar S.

Publikováno v: 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials & Packaging (EMAP) Conference; 2016, p1-5, 5p