Zobrazeno 1 - 10
of 38
pro vyhledávání: '"Haley Fu"'
Autor:
Renn Chan Ooi, Franco Costa, Sam Hsieh, Ethan Chiu, Wendy Xu, Dave Yu, Darwin Fan, Allen Cheng, Andrew Gattuso, Yongfu Wang, Currey Hsieh, Jeffery Toran, John Thompson, Pierre-Louis Toussaint, Ryan Curry, Loh Wei Keat, Ron Kulterman, Haley Fu
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d45560bc70c9f2100c0bd99809c7ca5
https://doi.org/10.1109/eptc56328.2022.10013256
https://doi.org/10.1109/eptc56328.2022.10013256
Autor:
Prabjit Singh, Kok Lieh Tan, Mei Ming Khaw, Haley Fu, Larry Palmer, Marko Pudas, Jason Keeping, Chen Xu
Publikováno v:
Scopus-Elsevier
Conformal coatings are applied to protect printed circuit boards and components mounted on them from the deleterious effects of moisture, particulate matter and corrosive gases. The conventional method of testing the effectiveness of these coatings i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::443d7cc113f8a370a14bfb0dfffb2248
https://doi.org/10.23919/empc53418.2021.9584977
https://doi.org/10.23919/empc53418.2021.9584977
Publikováno v:
2021 International Conference on Electronics Packaging (ICEP).
Drop Shock Reliability of mixed alloy SnAgCu-BiSn Flip Chip BGA solder joints assembled on a Shock Test Board with two different surface finishes (Cu Organic Solderability Protectant and Electroless Nickel Immersion Gold) using three different catego
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b20c3faa46dbb81820ec29a5c33a37ad
https://doi.org/10.23919/icep51988.2021.9451925
https://doi.org/10.23919/icep51988.2021.9451925
Autor:
Tatsuro Yoshida, Makoto Tsukahara, Haley Fu, Ron W. Kulterman, Kei Murayama, Arvind Purushotaman, Wei Keat Loh, Jenn An Wang, Kang Eu Ong
Publikováno v:
2021 International Conference on Electronics Packaging (ICEP).
Wafer warpage modeling is challenging for semiconductor industry because simulation tools need to consider multi-physics behavior and non-linear material properties. This paper conducted a wafer warpage experiment and simulation on bi-material wafer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0395fe6a4d717359985365a8c132a20d
https://doi.org/10.23919/icep51988.2021.9451946
https://doi.org/10.23919/icep51988.2021.9451946
Autor:
Wei Keat Loh, Ong Kang Eu, Haley Fu, Jenn An Wang, Chih Chung Hsu, Ron W. Kulterman, Wen Hsin Weng
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Predicting strip warpage after molding process is a challenge for IC packaging industry because simulation tools need to consider multiple processes and complex material properties. This paper conducted a strip warpage experiment and simulation. To s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ee78dbb1200d0ed514a3e68e6ea1211
https://doi.org/10.1109/impact50485.2020.9268561
https://doi.org/10.1109/impact50485.2020.9268561
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
This paper presents an analysis on panel warpage as the growth of the panel exceeds beyond current wafer sizes. This work is a part of iNemi working group "Wafer/Panel Level Package Flowability and Warpage Project". The aim of the project is to under
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1431aeaa49a00d7c086007e04d0516c9
https://doi.org/10.1109/estc48849.2020.9229746
https://doi.org/10.1109/estc48849.2020.9229746
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Low temperature solder (LTS) adoption has increased over the years with the primary focus on reducing energy consumption. The fundamentals of dynamic warpage are well established in SMT industry, but there is minimal literature on the application of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a91d931fa88d8786152698bc860da4f7
https://doi.org/10.1109/ectc.2019.00055
https://doi.org/10.1109/ectc.2019.00055
Publikováno v:
2019 International Conference on Electronics Packaging (ICEP).
Simulation tools such as FEA or CFD are widely employed to predict the thermal mechanical behavior of an electronic package based on the design and material attributes. Prediction accuracy and representation are highly dependent on the material model
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9019b893145f90678f84ab14c6ec61c1
https://doi.org/10.23919/icep.2019.8733601
https://doi.org/10.23919/icep.2019.8733601
Autor:
Janie Liu, Prabjit Singh, Jeffrey Lee, Chen Xu, Karlos Guo, Simon Lee, Larry Palmer, Geoffrey Tong, Dem Lee, Haley Fu
Publikováno v:
2019 Pan Pacific Microelectronics Symposium (Pan Pacific).
Knowledge of the rates at which an atmosphere will corrode metals has benefits. Corrosion rate is an indirect, though reliable indication of the concentrations of corrosive gases in the air. Today’s data centers require that for computers to work r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f48f13971694482807ebed36f1b13bbd
https://doi.org/10.23919/panpacific.2019.8696754
https://doi.org/10.23919/panpacific.2019.8696754
Publikováno v:
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT).
One of the challenges for developing an electronic package is to understand the dynamic warpage behavior of the package even before having the real physical sample. Hence, industry relies on the use of simulation tools, be it the finite element model
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::862fbe1c5330d844f143346fc8bf4467
https://doi.org/10.1109/iemt.2018.8511686
https://doi.org/10.1109/iemt.2018.8511686