Výsledky vyhledávání - "Hajime Tomokage"

Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding

Autor: Mutsumi Masumoto, Yoshiyuki Arai, Hajime Tomokage

Publikováno v: Transactions of The Japan Institute of Electronics Packaging. 6:38-42

Flip-chip bonding has several advantages, such as high precision, high density, short interconnections, and small parasitic elements. However, creating reliable interconnections between chips and substrates is the key issue in flip-chip bonding. In t

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ab32993ad1f33f144d15422cdaa03525
https://doi.org/10.5104/jiepeng.6.38

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Evaluation of relationship between residual stress of ICs and package warpage caused by flip-chip bonding

Autor: Younggun Han, Osamu Horiuchi, Hajime Tomokage, Toshio Enami

Publikováno v: 2016 International Conference on Electronics Packaging (ICEP).

Relationship between the stress of ICs and package warpage caused by flip-chip bonding is evaluated using piezoresistor chip and is measured by Moire measurement method. The die size is 9×9 mm2 with 200µm and 550µm in thickness. After non-conducti

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b72594222af15425aeab2eb17eff6fdf
https://doi.org/10.1109/icep.2016.7486871

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