Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Hajime Kikuiri"'
Autor:
Aiba Akira, Noritaka Takezoe, Hajime Kikuiri, Tomoyuki Habu, Kazuki Arikawa, Masaki Miura, Endo Shinichi, Hiroki Horibe, Hiroko Suzuki, Shintaro Yabu
Publikováno v:
International Symposium on Microelectronics. 2016:000478-000481
Lately, Semi Additive process has been considered to dry processing for the downsizing of the emiconductor packages. WET process is a process depending on the chemical reaction of the chemical solution. There are many problems with the formation of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7bf25a87ab5e5d6cbcb7bc681a908c6
https://doi.org/10.4071/isom-2016-tha44
https://doi.org/10.4071/isom-2016-tha44
Autor:
Darmawikarta Kristof, Michael Obrien, Hiroki Horibe, Aiba Akira, Jain Rahul, Toru Fujinami, Namai Masahito, Hajime Kikuiri, Shintaro Yabu, Tomoyuki Habu, Hiroko Suzuki, Endo Shinichi, Maruyama Shun
Publikováno v:
International Symposium on Microelectronics. 2015:000465-000468
Smear residue from the build-up dielectric material is left at the bottom of the microvia after laser drill process which, if not cleaned, poses risk to the electrical functionality of the device. Thus, microvia cleanliness is the key to a reliable a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::414fb2937b21a3a753c6bff9aabb4aaa
https://doi.org/10.4071/isom-2015-wp46
https://doi.org/10.4071/isom-2015-wp46
Autor:
Masaki Miura, Endo Shinichi, Shintaro Yabu, Hajime Kikuiri, Hiroki Horibe, Hiroko Suzuki, Aiba Akira, Tomoyuki Habu
Publikováno v:
2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Semi Additive process is considered to dry processing for the miniaturization of the semiconductor packages. There are many problems in the manufacturing substrate of print circuit board, at the materials, tools, processes, conditions etc. Wet proces
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d414b9f05e8e2a2caf6408358aade83e
https://doi.org/10.1109/impact.2017.8255908
https://doi.org/10.1109/impact.2017.8255908
Autor:
Masaki Miura, Aiba Akira, Endo Shinichi, Noritaka Takezoe, Hajime Kikuiri, Shintaro Yabu, Namai Masahito, Hiroki Horibe, Hiroko Suzuki, Kazuki Arikawa, Tomoyuki Habu
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Recently, it is required that the high density interconnect substrates implemented to the electrically functional devices must be smaller and thinner because of therapid spread of IoT. Microelectronics assembly and packaging technology also require h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cec17285df916388ee96769c6a41c44d
https://doi.org/10.1109/ectc.2016.361
https://doi.org/10.1109/ectc.2016.361