Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Haiwen Dai"'
Autor:
Syed Zulfiqar Hussain Shah, Zhenyu Ding, Zainul Aabdin, Weng Weei Tjiu, Jose Recatala‐Gomez, Haiwen Dai, Xiaoping Yang, Repaka Durga Venkata Maheswar, Gang Wu, Kedar Hippalgaonkar, Iris Nandhakumar, Pawan Kumar
Publikováno v:
Advanced Science, Vol 11, Iss 35, Pp n/a-n/a (2024)
Abstract Organic–inorganic hybrid thermoelectric (TE) materials have attracted tremendous interest for harvesting waste heat energy. Due to their mechanical flexibility, inorganic‐organic hybrid TE materials are considered to be promising candida
Externí odkaz:
https://doaj.org/article/7c69a30d368641bb80c3e7782b77eaec
Autor:
Senhui Fu, Haiwen Dai
Publikováno v:
Frontiers in Psychology, Vol 14 (2023)
IntroductionShort video communities have proliferated recently, opening up a new channel for the promotion of online businesses. The main challenge in marketing with short videos is how to inspire consumers.MethodsThis study employs viewer social ide
Externí odkaz:
https://doaj.org/article/13087c4dbb3d45c89e05a1730356dcdf
Publikováno v:
BMC Complementary and Alternative Medicine, Vol 17, Iss 1, Pp 1-7 (2017)
Abstract Background Acute lung injury (ALI) is an inflammatory disorder. Semen Cassiae has potent anti-inflammatory activities. The aim of our study was to investigate whether Semen Cassiae plays a protective effect on lipopolysaccharide (LPS)-induce
Externí odkaz:
https://doaj.org/article/dae750c789124dea8627eb8bcb14bdaa
Publikováno v:
Shock. 59:803-809
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::888f49b58d0c9ae667954643ac311746
https://doi.org/10.1097/shk.0000000000002107
https://doi.org/10.1097/shk.0000000000002107
Publikováno v:
Asian Journal of Technology Innovation. :1-26
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::094bf8b0fc02d759a60daf67a0a0211b
https://doi.org/10.1080/19761597.2023.2165955
https://doi.org/10.1080/19761597.2023.2165955
Publikováno v:
Technology Analysis & Strategic Management. 34:112-124
Drawing on social network theory and technological innovation literature, this study investigates how firm innovation mediates the relationship between tie strength of alliance network and the prob...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::81c9b064f47385f09de08d86057cdfac
https://doi.org/10.1080/09537325.2021.1890012
https://doi.org/10.1080/09537325.2021.1890012
Autor:
Rennv Wang, Haiwen Dai
Publikováno v:
Journal of Clinical Laboratory Analysis. 36
The purpose of this study was to investigate whether platelet count was associated with mortality in acute respiratory distress syndrome (ARDS) patients.We analyzed patients with ARDS from Multi-parameter Intelligent Monitoring in Intensive Care Data
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d3bc3e8bd6fecd4dad41aeb8b88ee198
https://doi.org/10.1002/jcla.24378
https://doi.org/10.1002/jcla.24378
Autor:
Richard Chang, Ren Qin, Vempati Srinivasa Rao, Jens Timo Neumann, Ramanpreet Singh Pahwa, Ramani Pichumani, Saisubramaniam Gopalakrishnan, Wang Jie, Haiwen Dai, Oo Zaw Min, David Ho Soon Wee, Tom Gregorich, Ma Tin Lay Nwe
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Deep Learning is being widely used to identify and segment various structures in 2D and 3D scans in fields such as robotics and medical imaging. We leverage this exciting technology to train state-of-the-art models for 3D object detection and segment
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d54f9bfe2de9f5dfb74f4f03209da7eb
https://doi.org/10.1109/ectc32696.2021.00345
https://doi.org/10.1109/ectc32696.2021.00345
Autor:
Ren Qin, Ong Ee Ping, David Ho Soon Wee, Huang Su, Haiwen Dai, Vempati Srinivasa Rao, Saisubramaniam Gopalakrishnan, Ramanpreet Singh Pahwa
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Yield improvement is a critical component of semiconductor manufacturing. It is done by collecting, analyzing, identifying the causes of defects, and then coming up with a practical solution to resolve the root causes. Semiconductor components such a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c222c7fc6fd8130725c7d16165c29918
https://doi.org/10.1109/ectc32696.2021.00143
https://doi.org/10.1109/ectc32696.2021.00143
