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Research of circuit manufacturing for new MID technology development

Autor: In Hwan Lee, Ho-Chan Kim, Haeyong Yun

Publikováno v: Journal of Mechanical Science and Technology. 31:5737-5743

Recently in the electronics industry, the circuits are growing more and more complex as the number of components increase due to high-performance electronics product development. Accordingly, the trend is smaller, lighter, and higher-concentration el

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::7cc313a38faf10d6dfec8c49c9ec01e7
https://doi.org/10.1007/s12206-017-1115-z

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Direct-print/cure as a molded interconnect device (MID) process for fabrication of automobile cruise controllers

Autor: Haeyong Yun, Ho-Chan Kim, Yanfeng Lu, Morteza Vatani, Jae-Won Choi

Publikováno v: Journal of Mechanical Science and Technology. 29:5377-5385

3D Molded interconnect device (MID) is referred to as a new paradigm of manufacturing electronic circuits with high design complexity by removing conventional wiring processes. Basically, manufacturing of MIDs consists of several steps: building a st

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::599d942f698450f0deaeacb848491658
https://doi.org/10.1007/s12206-015-1139-1

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Research for improved flexible tactile sensor sensitivity

Autor: In Hwan Lee, Haeyong Yun, Ho-Chan Kim

Publikováno v: Journal of Mechanical Science and Technology. 29:5133-5138

With the development of robotic technologies, in recent years these technologies have been applied to multidisciplinary fields of study. To operate similarly to a human being, many robot technologies require devices that can receive exterior stimulus

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::6339cfab67f0f2dbdebea825ddedbc8f
https://doi.org/10.1007/s12206-015-1112-z

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