Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Hae-A. Seul Shin"'
Autor:
Hae-A. Seul Shin, Young-Joo Lee, Kyoohee Woo, Boae Nam, Dae-Hyun Nam, Han-Wool Yeon, Young-Chang Joo
Publikováno v:
Electronic Materials Letters. 11:149-154
The mechanical fatigue of Cu films and lines on flexible substrates was investigated, and an improvement in the structures through the use of a MoTi alloy under-layer was proposed. Fatigue reliability was decreased by 3-fold in lines compared with fi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52dc53263dab131a8f4000f075ae36b3
https://doi.org/10.1007/s13391-014-4191-6
https://doi.org/10.1007/s13391-014-4191-6
Autor:
So-Yeon Lee, Dae-Hyun Nam, Ji Woo Kim, Young-Chang Joo, Se-Hee Lee, Jihoon Lee, Hae-A-Seul Shin
Publikováno v:
Journal of Materials Chemistry A. 3:11021-11030
Volumetric expansion of active materials during lithium (Li) insertion is a critical drawback of Li-alloy anodes and a major bottleneck for their wide adoption in rechargeable batteries. Here, we report on a novel fabrication method of a tin (Sn) ful
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6a623e8891f326f616ddfb279e8e8ef
https://doi.org/10.1039/c5ta00884k
https://doi.org/10.1039/c5ta00884k
Autor:
Byoung-Joon Kim, Young-Chang Joo, Jihoon Lee, Hae-A. Seul Shin, Oliver Kraft, Tae-Youl Yang, In-Suk Choi, Thomas Haas, Patric A. Gruber
Publikováno v:
Journal of Materials Research. 29:2827-2834
The thickness dependence of the electrical stability under monotonic and cyclic tensile loading is investigated for Cu films on polymer substrates. As for monotonic tensile deformation, thicker films show better stability than thinner films due to th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b8fce86b34785c2de5d8e62c9e7f88de
https://doi.org/10.1557/jmr.2014.339
https://doi.org/10.1557/jmr.2014.339
Publikováno v:
Small. 10:3397-3404
Deformation behavior of the Ag nanowire flexible transparent electrode under bending strain is studied and results in a novel approach for highly reliable Ag nanowire network with mechanically welded junctions. Bending fatigue tests up to 500,000 cyc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f83bcdc899e1274ed786d286e9804f21
https://doi.org/10.1002/smll.201303906
https://doi.org/10.1002/smll.201303906
Autor:
Hae-A. Seul Shin, Oliver Kraft, In-Suk Choi, Yigil Cho, Sung-Yup Jung, Byoung-Joon Kim, Young-Chang Joo
Publikováno v:
Acta Materialia. 61:3473-3481
The evolution of damage due to mechanical fatigue in thin metal films on flexible substrates was investigated by in situ electrical resistance measurements. A tensile fatigue load was applied to the metal films by subjecting a single edge of the curv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47543291ae38da7ac2c6287d160d80d7
https://doi.org/10.1016/j.actamat.2013.02.041
https://doi.org/10.1016/j.actamat.2013.02.041
Autor:
Hae-A. Seul Shin, Sung-Hwan Hwang, Kwang-Yoo Byun, B.-J. Kim, Nobumichi Tamura, Qwan-Ho Chung, Min Suk Suh, Ho-Young Son, Young-Chang Joo, Arief Suriadi Budiman, Martin Kunz
Publikováno v:
Microelectronics Reliability. 52:530-533
Through-silicon via (TSV) has been used for 3-dimentional integrated circuits. Mechanical stresses in Cu and Si around the TSV were measured using synchrotron X-ray microdiffraction. The hydrostatic stress in Cu TSV went from high tensile of 234 MPa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5c9b42ce83caa41d76f9aa56385224a
https://doi.org/10.1016/j.microrel.2011.10.016
https://doi.org/10.1016/j.microrel.2011.10.016
Autor:
Dong-Ik Kim, Ho-Young Son, Ju-Heon Kim, Arief Suriadi Budiman, Hae-A. Seul Shin, Nobumichi Tamura, Martin Kunz, Byoung-Joon Kim, Young-Chang Joo, Sung-Hwan Hwang, Kwang-Yoo Byun
Publikováno v:
Journal of Electronic Materials. 41:712-719
The microstructural evolution of Cu through-silicon vias (TSVs) during thermal annealing was investigated by analyzing the Cu microstructure and the effects of twin boundaries and stress in the TSV. The Cu TSV had two regions with different grain siz
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::742fa87c1721ef173d71d2ad9c6b67cd
https://doi.org/10.1007/s11664-012-1943-7
https://doi.org/10.1007/s11664-012-1943-7
Publikováno v:
Nanoscale. 6(13)
Graphene-induced abnormal grain growth of Cu with a grain size of more than 1 mm(2) was observed on Cu-Ag alloy foil, and this phenomenon occurred only with graphene synthesis and only on the Cu-Ag alloy among various types of Cu foils.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::82fa1f54c909168860d934e1dbbccabc
https://pubmed.ncbi.nlm.nih.gov/24879370
https://pubmed.ncbi.nlm.nih.gov/24879370
Autor:
Eun-Kyu Lee, Byung Hee Hong, Jin-Sung Park, Nayoung Kim, Zonghoon Lee, Hae A. Seul Shin, Seungmin Cho, Gyeong Hee Ryu, Sang Jin Kim, Youngsoo Kim, Jaechul Ryu, Don-Yeop Cho, Sung-Pyo Cho, Dong-kwan Won
Publikováno v:
ACS nano. 8(1)
The practical use of graphene in consumer electronics has not been demonstrated since the size, uniformity, and reliability problems are yet to be solved to satisfy industrial standards. Here we report mass-produced graphene films synthesized by hydr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::260b5c7fc417f0ea3832cefd4e43507d
https://pubmed.ncbi.nlm.nih.gov/24358985
https://pubmed.ncbi.nlm.nih.gov/24358985
Publikováno v:
Japanese Journal of Applied Physics. 55:06JF01
The electrical reliability of a multi-layer metal film on a polymer substrate during cyclic inner bending and outer bending is investigated using a bending fatigue system. The electrical resistance of a Cu film on a polymer substrate during cyclic ou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd23eb4b3e2da9cf990f68b3141fdaed
https://doi.org/10.7567/jjap.55.06jf01
https://doi.org/10.7567/jjap.55.06jf01