Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Hadi, Richard Al"'
Inverted Scanning Microwave Microscope for In Vitro Imaging and Characterization of Biological Cells
Autor:
Farina, Marco, Jin, Xin, Fabi, Gianluca, Pavoni, Eleonora, di Donato, Andrea, Mencarelli, Davide, Morini, Antonio, Piacenza, Francesco, Hadi, Richard Al, Zhao, Yan, Pietrangelo, Tiziana, Cheng, Xuanhong, Hwang, James C. M.
Publikováno v:
Farina, M. et al. Inverted Scanning Microwave Microscope for In Vitro Imaging and Characterization of Biological Cells. Appl. Phys. Lett. doi.org/10.1063/1.5086259 (2019)
This paper presents for the first time an innovative instrument called an inverted scanning microwave microscope (iSMM), which is capable of noninvasive and label-free imaging and characterization of intracellular structures of a live cell on the nan
Externí odkaz:
http://arxiv.org/abs/1903.04605
Akademický článek
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Autor:
Fabi, Gianluca, Joseph, C. H., Pavoni, Eleonora, Wang, Xiaopeng, Hadi, Richard Al, Hwang, James C. M., Morini, Antonio, Farina, Marco
Publikováno v:
IEEE Transactions on Microwave Theory & Techniques; May2021, Vol. 69 Issue 5, p2662-2672, 11p
Publikováno v:
8th European Conference on Antennas & Propagation (EuCAP 2014); 2014, p717-721, 5p
Publikováno v:
2012 IEEE Bipolar/BiCMOS Circuits & Technology Meeting (BCTM); 1/ 1/2012, p1-4, 4p
Autor:
Sherry, Hani, Grzyb, Janusz, Zhao, Yan, Hadi, Richard Al, Cathelin, Andreia, Kaiser, Andreas, Pfeiffer, Ullrich
Publikováno v:
2012 IEEE International Solid-State Circuits Conference; 1/ 1/2012, p252-254, 3p
Publikováno v:
2016 Conference on Lasers & Electro-Optics (CLEO); 2016, p1-2, 2p
Autor:
Zhao, Yan, Chen, Zuow-Zun, Virbila, Gabriel, Xu, Yinuo, Hadi, Richard Al, Kim, Yanghyo, Tang, Adrian, Reck, Theodore, Chen, Huan-Neng, Jou, Chewnpu, Hsueh, Fu-Lung, Chang, Mau-Chung Frank
Publikováno v:
2016 IEEE International Solid-State Circuits Conference (ISSCC); 1/1/2016, p36-37, 2p
Autor:
Pfeiffer, Ullrich R., Zhao, Yan, Grzyb, Janusz, Hadi, Richard Al, Sarmah, Neelanjan, Forster, Wolfgang, Rucker, Holger, Heinemann, Bernd
Publikováno v:
2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC); 2014, p256-257, 2p