Formation, distribution and failure effects of voids in vapor-phase soldered small solder volumes.

Autor: Villain, J., Beschorner, M., Hacke, H.J., Brabetz, B., Zapf, J.

Publikováno v: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties & Interfaces (Cat. No.00TH8507); 2000, p141-144, 4p