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Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Growth in the usage of heterogenous integration and chiplets-based designs in modern advanced packages for leading applications like AI and HPC is driving the need for very large chip sizes that exceed the dimensions of a single back-end stepper expo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::927770d465b8e1aa8940c8758c6aedd6
https://doi.org/10.1109/ectc32696.2021.00321
https://doi.org/10.1109/ectc32696.2021.00321
Autor:
Le, Diep Ngoc, Nguyen, Ha Ai Phan, Ngoc, Dang Tran, Do, Thuong Hoai Thi, Ton, Nghia Tuan, Van Le, Tuan, Ho, Tinh Huu, Van Dang, Chinh, Thai, Phong K., Phung, Dung
Publikováno v:
Environmental Science & Pollution Research; Dec2022, Vol. 29 Issue 60, p91165-91175, 11p
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Wafer-level packaging with high density fan-out (HDFO) requires multiple redistribution layers (RDL) to handle the high-density interconnections and the large data transfer rates between chips in the package. Decreasing the critical dimension (CD) of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d28c73578bba241778250a7175cea319
https://doi.org/10.1109/ectc32862.2020.00179
https://doi.org/10.1109/ectc32862.2020.00179
Autor:
Ambarish Vaidyanathan, Armistead G. Russell, M. Talat Odman, Scott L. Goodrick, Yongtao Hu, Ha Ai
Publikováno v:
Springer Proceedings in Complexity ISBN: 9783030220549
The HiRes-2 system, operational since 2015, provides daily forecasts of potential prescribed fire impacts on air quality. The system uses the WRF and CMAQ models for meteorology and air quality computations. A decision tree model predicts prescribed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee93a9b07492ddb2d0fac3ca4ae8f487
https://doi.org/10.1007/978-3-030-22055-6_36
https://doi.org/10.1007/978-3-030-22055-6_36
Autor:
Andy Miller, Akito Hiro, Romain Ridremont, John Slabbekoorn, Samuel Suhard, Robert Hsieh, Warren W. Flack, Ha-Ai Nguyen
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
This study investigates creation of $1.0 \mu \mathrm{m}$ RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is that the Cu overburden removal does no
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6169bd12f6aa5c0f286fbd515d9223c4
https://doi.org/10.1109/eptc.2018.8654363
https://doi.org/10.1109/eptc.2018.8654363
Publikováno v:
2017 ASEE Annual Conference & Exposition Proceedings.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3d42603a893ef5698a61dfc8b9e8ba6
https://doi.org/10.18260/1-2--28697
https://doi.org/10.18260/1-2--28697
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Fan-Out wafer level packaging has seen rapid adoption over the last few years due to its form factor, performance, and cost advantages compared to 3D packaging techniques. Redistribution layers (RDL) are used to route the very high density connection
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8202099928c9d84ea4f5adaf2e7d8811
https://doi.org/10.1109/eptc.2017.8277536
https://doi.org/10.1109/eptc.2017.8277536
Publikováno v:
Proceedings of SPIE.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c36d8d510649a9e48226aee0098c184
https://doi.org/10.1117/12.711606
https://doi.org/10.1117/12.711606