Zobrazeno 1 - 10
of 64
pro vyhledávání: '"HUICHU LIU"'
Autor:
Huichu Liu, Sasikanth Manipatruni, Daniel H. Morris, Kaushik Vaidyanathan, Dmitri E. Nikonov, Tanay Karnik, Ian A. Young
Publikováno v:
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, Vol 5, Iss 1, Pp 1-9 (2019)
The supply voltage scaling has become increasingly challenging in the advanced CMOS technology due to the threshold voltage requirement for transistor OFF leakage, limiting the system energy efficiency. Spintronic logic utilizes the physical quantity
Externí odkaz:
https://doaj.org/article/69fc544b79d748f1b0b900a927396e46
Autor:
Kaushik Vaidyanathan, Daniel H. Morris, Uygar E. Avci, Huichu Liu, Tanay Karnik, Hong Wang, Ian A. Young
Publikováno v:
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, Vol 4, Iss 1, Pp 10-18 (2018)
Reducing VDD while keeping leakage current low is critical for minimizing energy consumption for systems across the compute-continuum, especially in IoT. Emerging low-VDD logic devices such as tunnel FET (TFETs) offer better low-VDD performance than
Externí odkaz:
https://doaj.org/article/f77eecbcb6344509badf43afe2175e85
Autor:
Huichu Liu, Sasikanth Manipatruni, Daniel H. Morris, Kaushik Vaidyanathan, Dmitri E. Nikonov, Tanay Karnik, Ian A. Young
Publikováno v:
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, Vol 5, Iss 2, Pp 74-74 (2019)
In the above paper [1], the following Acknowledgment was not included.
Externí odkaz:
https://doaj.org/article/2fb62d1fd03d4308a4d4c02eaafc9340
Autor:
Lita Yang, Robert Radway, Yu-Hsin Chen, Tony Wu, Huichu Liu, Elnaz Ansari, Vikas Chandra, Subhasish Mitra, Edith Beigne
Publikováno v:
IEEE Micro. 42:116-124
Autor:
Daniel H Morris, Huichu Liu, Tony F Wu, H Ekin Sumbul, Elnaz Ansari, Alexandre Barachant, Jonathan Reid, Edith Beigne
Publikováno v:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Autor:
H. Ekin Sumbul, Tony F. Wu, Yuecheng Li, Syed Shakib Sarwar, William Koven, Eli Murphy-Trotzky, Xingxing Cai, Elnaz Ansari, Daniel H. Morris, Huichu Liu, Doyun Kim, Edith Beigne, Reality Labs, null Meta
Publikováno v:
2022 IEEE Custom Integrated Circuits Conference (CICC).
Publikováno v:
IEEE Solid-State Circuits Magazine. 13:107-110
Publikováno v:
2022 Design, Automation & Test in Europe Conference & Exhibition (DATE).
Publikováno v:
ISSCC
The end of transistor scaling drives innovative 2.5D, 3D and chiplet technologies to further extend Moore’s law. Recent advancements in multi-die integration effectively reduce the costs at advanced nodes while providing more flexibility, modularit
Autor:
Huichu Liu, Keith Bowman, Alicia Klinefelter, Ofer Shacham, David Bol, Alvin Leng Sun Loke, Luca Benini, Yvain Thonnart, Kathy Wilcox
Publikováno v:
ISSCC
For years there has been a call to increase remote work, conferencing, and education. Although many companies have geographically distributed teams and students have moved to online instruction, remote working and learning has yet to become the norm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::54d14849a0cd9132d345bc67c61f8126
http://hdl.handle.net/11585/863912
http://hdl.handle.net/11585/863912