Zobrazeno 1 - 10
of 22
pro vyhledávání: '"HUANG Li-yang"'
Publikováno v:
Cailiao gongcheng, Vol 44, Iss 12, Pp 92-99 (2016)
The thermal-electric finite element simulation model of carbon fiber reinforced plastic(CFRP) damage caused by lightning strike was established. The superimposed temperature was treated as the internal injury. The accuracy and effectiveness of couple
Externí odkaz:
https://doaj.org/article/8e15b1caf86d47d38d59d24da185bdd3
Publikováno v:
Zhipu Xuebao, Vol 45, Iss 4, Pp 482-491 (2024)
Study of chemical properties of water radical cations is of great significance for elucidating related reactions process. In this paper, the reaction characteristics of (H2O)2+• prepared online with several benzene derivatives were investigated. Th
Externí odkaz:
https://doaj.org/article/37e2aeffe74b44cc93ffc3490a8941f0
Publikováno v:
In Integration, the VLSI Journal March 2016 53:138-144
Publikováno v:
In Applied Surface Science 2011 257(17):7693-7698
Akademický článek
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Autor:
Huang, Li-Yang, 黃立洋
105
Most of the activities in real life, from business to sports competitions are affected by both luck and strength. Understand the role of luck and strength in these activities, and what kind of attitude and strategy should be used to face the
Most of the activities in real life, from business to sports competitions are affected by both luck and strength. Understand the role of luck and strength in these activities, and what kind of attitude and strategy should be used to face the
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/63bfm7
Autor:
Chen, Heng-Yi, Lin, Tse-Yu, Huang, Li-Yang, Chen, An-Chun, Zheng, Yu-Chen, Wang, Hsing-Mang, Wei, Shi-Yao, Chou, Yin-Yu
Publikováno v:
ACM International Conference Proceeding Series; 11/25/2018, p397-402, 6p
Autor:
Huang, Li Yang
Naphthenic acids (NAs) comprise a complex mixture of alkyl-substituted acyclic and cycloaliphatic carboxylic acids. NAs are present in wastewaters at petroleum refineries and in the process waters of oil sands extraction plants where they are primari
Autor:
Huang, Li-Yang, 黃立陽
97
The technology of wafer direct bonding has been employed in present study to bond several types of silicon bonded wafer pairs with various interfacial SiO2 layers, such as: a silicon wafer with a surface native oxide layer bonded to another s
The technology of wafer direct bonding has been employed in present study to bond several types of silicon bonded wafer pairs with various interfacial SiO2 layers, such as: a silicon wafer with a surface native oxide layer bonded to another s
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/30069515584580804129
Autor:
Lin, Tse-Yu, Wei, Shih-Yao, Chen, Heng-Yi, Huang, Li-Yang, Liu, Chih-Yun, Chen, An-Chun, Chou, Yin-Yu, Wang, Hsing-Mang
Publikováno v:
MobiCom: International Conference on Mobile Computing & Networking; 2018, p744-746, 3p