Zobrazeno 1 - 1
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pro vyhledávání: '"HUA JianWei"'
Publikováno v:
Jixie qiangdu, Vol 40, Pp 938-942 (2018)
Based on ANSYS software established board level optical interconnect module finite element model,by means of the analysis of the model of the thermal-structure random vibration coupling,obtained the data of stress and strain under the coupling condit
Externí odkaz:
https://doaj.org/article/70e2fb8524404ccfbe5db05e3091361f
