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pro vyhledávání: '"H.J. Hovel"'
Autor:
H.J. Hovel
Publikováno v:
Solid-State Electronics. 47:1311-1333
A mercury-based “pseudo-MOSFET” is described which can be used to measure many electrical properties of the Si film in silicon-on-insulator (SOI) substrates, including the electron and hole mobilities, flat band and threshold voltages, BOX charge
Autor:
Kathryn W. Guarini, Guy M. Cohen, H.J. Hovel, J. Benedict, C. Cabral, K. Petrarca, Diane C. Boyd, Raymond M. Sicina, J.H. Yoon, J. Newbury, P. Kozlowski, Paul M. Solomon, Hon-Sum Philip Wong, Christopher P. D'Emic, A. Krasnoperova, M. Ronay, K.K. Chan, V. Ku, O. Dokumaci, Christian Lavoie, Inna V. Babich, J.J. Bucchignano, E.C. Jones, J. Treichler, Y. Zhang
Publikováno v:
IEEE Circuits and Devices Magazine. 19:48-62
A planar self-aligned double-gate MOSFET process has been implemented where a unique sidewall source/drain structure (S/D) permits self-aligned patterning of the back-gate layer after the S/D structure is in place. This allows coupling the silicon th
Publikováno v:
Sixth International Conference Metalorganic Vapor Phase Epitaxy.
Autor:
H.J. Hovel
Publikováno v:
Proceedings of 1993 IEEE International SOI Conference.
Photoluminescence (PL) and photoreflectance (PR) intensity maps of silicon-on-insulator (SOI) wafers tend to reveal much more than bare silicon. They are often rich in features due to both reflectance variations arising from the optical properties of
Publikováno v:
Proceedings of 1993 IEEE International SOI Conference.
In this paper, the outlook for the SOI technology in the sub-0.25 /spl mu/m CMOS regime is discussed. The key challenges and opportunities for the SOI technology to become a main stream semiconductor technology are presented. >
Publikováno v:
Proceedings of 1993 IEEE International SOI Conference.
Silicon-on-insulator (SOI) is very promising for submicron CMOS due to low parasitic capacitance, higher potential speed, and ease of isolation. The major requirements for the starting material are: 1) thin Si layers, 2) low active defect densities,
Publikováno v:
Proceedings of 1993 IEEE International SOI Conference.
It is well established that CMOS SOI technology provides improved device and circuit performance compared to bulk silicon. Extremely fast ring oscillators with delay time as low as 20 ps at 1.5 V and operating at room temperature have been demonstrat
Autor:
H.J. Hovel
Publikováno v:
1996 IEEE International SOI Conference Proceedings.
The task in SOI substrate material is now to establish that high performance and reliability can be obtained routinely and consistently, in spite of the fact that SOI wafers are still made in a small batch processes. Circuits of interest must be obta
Autor:
J.Y.-C. Sun, Stephan A. Cohen, H.J. Hovel, Y.-J. Mii, D. K. Sadana, Yuan Taur, Christopher P. D'Emic, K.K. Chan
Publikováno v:
Proceedings. IEEE International SOI Conference.
We present the first comparison of 0.25 /spl mu/m nMOSFET devices fabricated on SOS, SIMOX and BSOI substrates with a fully depleted (FD) device design for low power analog and digital applications. All the substrates were processed nearly identicall
Publikováno v:
Proceedings. IEEE International SOI Conference.
Two new classes of defects have been identified in commercial SIMOX, plasma thinned BSOI and BESOI materials. The first class of defects are revealed when the materials are treated in concentrated HF, and their density is in the range 10/sup 2/-10/su