Zobrazeno 1 - 10
of 19
pro vyhledávání: '"H.I. Rosten"'
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 20:384-391
The accurate prediction of the temperatures of critical electronic parts at the package, board and system level is seriously hampered by the lack of reliable, standardized input data that characterize the thermal behaviour of these parts. The recentl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc435f95fc5a0f3fab3c79013e909b0e
https://doi.org/10.1109/95.650927
https://doi.org/10.1109/95.650927
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 20:392-398
For pt.I see ibid., vol.20, no.4, pp.384-91 (1997). The purpose of the second part of the DELPHI survey paper is twofold. First, to describe the experimental methods that have been developed to validate the numerical models generated to characterize
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47991cbe0dbbd7a4a6d88c9636f90355
https://doi.org/10.1109/95.650928
https://doi.org/10.1109/95.650928
Autor:
H.I. Rosten
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
The accurate prediction of the operating temperatures of critical electronic parts at the component-, board- and system-level is seriously hampered by the lack of reliable, standardised input data. This paper reports an the status of work-in-progress
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7af5cf62153691aff0b481521e110d9
https://doi.org/10.1109/ectc.1996.517390
https://doi.org/10.1109/ectc.1996.517390
Publikováno v:
Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
Natural convection is the most desirable cooling mechanism for electronic enclosures. Limited cooling capacity with natural convection requires identification and optimization of parameters impacting cooling. A set of such parameters is circuit pack
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f026efbb209b129bce46c123126e226f
https://doi.org/10.1109/stherm.1994.288997
https://doi.org/10.1109/stherm.1994.288997
Autor:
Ram S. Viswanath, H.I. Rosten
Publikováno v:
1994 Proceedings. 44th Electronic Components and Technology Conference.
Large mono-chip packages show a trend of increasing power dissipation and power density: for example the maximum dissipation of the Pentium processor is 16 Watts compared to the 6 Watts of its 80486 predecessor. This poses challenges for equipment de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c8dd0336656f416bdbcd410a3ce7fd35
https://doi.org/10.1109/ectc.1994.367556
https://doi.org/10.1109/ectc.1994.367556
Autor:
P. Zemlianoy, H.I. Rosten, T. Gautier, H. Vinke, M. O'Flattery, Clemens J. M. Lasance, C. Cahill, W. Temmerman, C. Lacaze, W. Nelemans, Y. Assouad, O. Slattery, John Parry
Publikováno v:
Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.
The accurate prediction of the operating temperatures of critical electronic parts at the component-, board- and system-level is seriously hampered by the lack of reliable, standardised input data. This paper is the final report on the 3-year Europea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96375c1a8f3d0fc14d4825e9e17a3c2d
https://doi.org/10.1109/stherm.1997.566785
https://doi.org/10.1109/stherm.1997.566785
Publikováno v:
1995 Proceedings. 45th Electronic Components and Technology Conference.
A thermal model of a Plastic Quad Flat Pack (PQFP), developed using a computational fluid dynamics (CFD) program is presented. The model predictions are validated with junction-to-ambient thermal resistances measured in still air and infra-red measur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4eb7ee97f93a35d24ac5c2ac3e35aa7d
https://doi.org/10.1109/ectc.1995.517835
https://doi.org/10.1109/ectc.1995.517835
Publikováno v:
Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
The accurate prediction of operating temperatures of temperature sensitive electronic parts at the component, board and system level is seriously hampered by the lack of reliable, standardized input data. The situation which prevails today is that co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb7777ffd07af4563fdbf2fcfc3d78b1
https://doi.org/10.1109/stherm.1995.512044
https://doi.org/10.1109/stherm.1995.512044
Conference
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Akademický článek
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